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datasheet 245483 - 002 mobile pentium a iii processor in bga2 and micro - pga2 packages featuring intel speedstep? technology at 750 mhz, 700 mhz, and low - voltage 600 mhz datasheet product features n processor core/bus speeds: ? featuring intel ? speedstep tm technology: 750/100 mhz ( maximum performance mode at 1.60v) and 600/100 mhz (battery optimized mode at 1.35v) ? featuring intel speedstep technology: 700/100 mhz ( maximum performance mode at 1.60v) and 550/100 mhz (battery optimized mode at 1.35v) ? featuring intel speedstep techno logy: low - voltage 600/100 mhz ( maximum performance mode at 1.35v) and 500/100 mhz (battery optimized mode at 1.10v) n supports the intel architecture with dynamic execution n on - die primary 16 - kbyte instruction cache and 16 - kbyte write - back data cache n on - die second level cache (256 - kbyte) n integrated gtl+ termination n integrated math co - processor n intel processor serial number n bga2 and micro - pga2 packaging technologies ? supports thin form factor notebook designs ? exposed die enables more efficient heat dissipation n fully compatible with previous intel microprocessors ? binary compatible with all applications ? support for mmx? technology ? support for streaming simd extensions n power management features ? quick start and deep sleep modes provide low - power dissipation n on - die thermal diode
datasheet 245483 - 002 information in this document is provided in conne ction with intel products. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. except as provided in intel's terms and conditions of sale for such products, intel assumes no liability w hatsoever, and intel disclaims any express or implied warranty, relating to sale and/or use of intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. intel products are not intended for use in medical, life saving, or life sustaining applications. intel may make changes to specifications and product descriptions at any time, without notice. designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. the intel ? mobile pentium ? iii processor may contain design defects or errors known as errata that may cause the product to deviate from published specifications. current characterized errata are available on request. contact your local intel sales office or your distributor to obtain the latest specifications and before placing your product order. copies of documents which have an order number and are referenced in this document, or other intel literature, may be obtained by calling1 - 800 - 548 - 4725 or by visiti ng intel?s web site at http://www.intel.com copyright ? intel corporation, 1998 - 2000. *other brands and names are the property of their respective owners.
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz 245483 - 002 data sheet i contents 1.0 introduction ................................ ................................ ................................ .......................... 1 1.1 overview ................................ ................................ ................................ ........ 4 1.2 terminology ................................ ................................ ................................ ... 4 1.3 references ................................ ................................ ................................ ..... 5 2.0 mobile pentium iii processor features ................................ ................................ ................. 6 2.1 new features in the mobile pentium iii processor ................................ ............ 6 2.1.1 on - die gtl+ termination ................................ ................................ .... 6 2.1.2 streaming simd extensions ................................ ................................ 6 2.1.3 intel speedstep technology ................................ ................................ 6 2.1.4 signal differences between the mobile p entium ii processor and the mobile pentium iii processor ................................ ............................... 6 2.2 power management ................................ ................................ ........................ 7 2.2.1 clock control architecture ................................ ................................ ... 7 2.2.2 normal state ................................ ................................ ...................... 7 2.2.3 auto halt state ................................ ................................ ................... 7 2.2.4 stop grant state ................................ ................................ ................. 8 2.2.5 quick start state ................................ ................................ ................ 9 2.2.6 halt/grant snoop state ................................ ................................ ..... 9 2.2.7 sleep state ................................ ................................ ........................ 9 2.2.8 deep sleep state ................................ ................................ ............. 10 2.2.9 operating system implications of low - power states ........................... 10 2.2.10 intel speedstep technology ................................ .............................. 10 2.3 gtl+ signals ................................ ................................ ............................... 11 2.4 mobile pentium iii processor cpuid ................................ .............................. 11 3.0 electrical specifications ................................ ................................ ................................ ..... 12 3.1 processor system signals ................................ ................................ ............. 12 3.1.1 power sequencing requirem ents ................................ ...................... 13 3.1.2 test access port (tap) connection ................................ ................... 13 3.1.3 catastrophic thermal protection ................................ ........................ 14 3.1.4 unused signals ................................ ................................ ................ 14 3.1.5 signal state i n low - power states ................................ ....................... 14 3.1.5.1 system bus signals ................................ ......................... 14 3.1.5.2 cmos and open - drain signals ................................ ......... 14 3.1.5.3 other signals ................................ ................................ ... 15 3.2 power supply req uirements ................................ ................................ ......... 15 3.2.1 decoupling recommendations ................................ .......................... 15 3.2.2 voltage planes ................................ ................................ ................. 16 3.3 system bus clock and processor clocking ................................ .................... 16 3.4 intel speeds tep technology ................................ ................................ .......... 16 3.5 maximum ratings ................................ ................................ ......................... 17 3.6 dc specifications ................................ ................................ ......................... 17 3.7 ac specifications ................................ ................................ ......................... 20
mobile pentium? iii processor i n bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz datasheet 245483 - 002 ii 3.7.1 system bus, clock, apic, tap, cmos, and open - drain ac specifications ................................ ................................ ................... 20 4.0 system signal simulations ................................ ................................ ................................ . 33 4.1 system bus clock (bclk) and picclk ac signal quality specifications ......... 33 4.2 gtl+ ac signal qualit y specifications ................................ ........................... 34 4.3 non - gtl+ signal quality specifications ................................ ......................... 37 4.3.1 pwrgood signal quality specifications ................................ ........... 38 5.0 mechanical specifications ................................ ................................ ................................ .. 39 5.1 surface - mount bga2 package dimensions ................................ .................... 39 5.2 socketable micro - pga2 package dimensions ................................ ................ 42 5.3 signal listings ................................ ................................ .............................. 44 6.0 thermal specifications ................................ ................................ ................................ ....... 53 6.1 thermal diode ................................ ................................ .............................. 54 7.0 processor initialization and configuration ................................ ................................ ......... 56 7.1 description ................................ ................................ ................................ ... 56 7.1.1 quick start enable ................................ ................................ ............ 56 7.1.2 system bus frequency ................................ ................................ ..... 56 7.1.3 apic enable ................................ ................................ ..................... 56 7.2 clock frequencies and ratios ................................ ................................ ....... 56 8.0 processor interface ................................ ................................ ................................ ............ 57 8.1 alphabetical sig nal reference ................................ ................................ ....... 57 8.2 signal summaries ................................ ................................ ......................... 69 appendix a. pll rlc filter specification ................................ ................................ ................... 71 a.1 introduction ................................ ................................ ................................ . 71 a.2 filter specification ................................ ................................ ....................... 71 a.3 recommendation for mobile systems ................................ ............................ 72 a.4 comments ................................ ................................ ................................ ... 73 appendix b. intel mobile voltage positioning (imvp) for the mobile pentium iii processor ......... 74 b.1 introduction ................................ ................................ ................................ . 74 b.2 reference documents ................................ ................................ .................. 74
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz 245483 - 002 data sheet iii figures figure 1. signal groups of a mobile pentium iii processor/440bx agpset - based system ................................ ................................ ................................ ........ 2 figure 2. signal groups of a mobile pentium iii processor/440mx chipset - based system ................................ ................................ ................................ ........ 3 figure 3. clock control states ................................ ................................ ..................... 8 figure 4. vcc ramp rate requirement ................................ ................................ ...... 13 figure 5. pll rlc filter ................................ ................................ ............................ 16 figure 6. picclk/tck clock timing waveform ................................ .......................... 26 figure 7. bclk timing waveform ................................ ................................ .............. 26 figure 8. valid delay timings ................................ ................................ .................... 27 figure 9. setup and hold timings ................................ ................................ .............. 27 figure 10. cold/warm reset and configuration timings ................................ .............. 28 figure 11. power - on reset timings ................................ ................................ ........... 28 figure 12. test ti mings (boundary scan) ................................ ................................ ... 29 figure 13. test reset timings ................................ ................................ ................... 29 figure 14. quick start/deep sleep timing ................................ ................................ .. 30 figure 15. stop grant/sleep/deep sleep timing ................................ ......................... 31 figure 16. intel speedstep technology/deep sleep timing ................................ ......... 32 figure 17. bclk/picclk generic clock waveform ................................ .................... 34 figure 18. low to high, gtl+ receiver ringback tolerance ................................ ....... 35 figure 19. high to low, gtl+ receiver ringback tolerance ................................ ....... 36 figure 20. maximum acceptable overshoot/undershoot waveform ............................. 37 figure 21. surface - mount bga2 package - top and side vie w ................................ ... 40 figure 22. surface - mount bga2 package - bottom view ................................ ............ 41 figure 23. socketable micro - pga2 package - top and side view ............................... 43 figure 24. socketable micro - pga2 package - bottom view ................................ ......... 44 figure 25. pin/ball map - top view ................................ ................................ ............ 45 figure 26. pwrgood relationship at power on ................................ ....................... 64 figure 27. pll filter specifications ................................ ................................ ............ 72
mobile pentium? iii processor i n bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz datasheet 245483 - 002 iv tables table 1. new mobile pentium iii processor signals ................................ ....................... 6 table 2. removed mobile pentium ii processor signals ................................ ................ 6 table 3. clock state characteristics ................................ ................................ ........... 10 table 4. mobile pentium iii processor cpuid ................................ ............................. 11 table 5. mobile pentium iii processor cpuid cache and tlb descriptors ................... 11 table 6. system signal groups ................................ ................................ ................. 12 table 7. recommended resistors for mobile pentium iii processor signals ................. 13 table 8. mobile pentium iii processor absolute maximum ratings ............................... 17 table 9. mobile pentium iii processor power specificat ions ................................ ........ 18 table 10. gtl+ signal group dc specifications ................................ ......................... 19 table 11. gtl+ bus dc specifications ................................ ................................ ...... 19 table 12. clock, apic, tap, cmos, and open - drain signal group dc spec ifications .. 20 table 13. system bus clock ac specifications ................................ ........................... 21 table 14. valid mobile pentium iii processor frequencies ................................ ........... 21 table 15. gtl+ signal groups ac specificatio ns ................................ ....................... 22 table 16. cmos and open - drain signal groups ac specifications .............................. 22 table 17. reset configuration ac specifications ................................ ........................ 23 table 18. apic bus signal ac specifications ................................ ............................. 23 table 19. tap signal ac specifications ................................ ................................ ..... 24 table 20. quick start/deep sleep ac specifications ................................ ................... 25 table 21. stop grant/sleep/deep sleep ac specifications ................................ .......... 25 table 22. intel speedstep technology ac specifications ................................ ............ 25 table 23. bclk signal quality specifications ................................ ............................. 33 table 24. picclk signal quality specifications ................................ .......................... 33 table 25. gtl+ signal group ringback specification ................................ ................. 35 table 26. gtl+ signal group overshoot/undershoot tolerance at the processor core 36 table 27. non - gtl+ signal group overshoot/unde rshoot tolerance at the processor core ................................ ................................ ................................ ......... 38 table 28. surface - mount bga2 package specifications ................................ .............. 39 table 29. socketable micro - pga2 package specification ................................ ........... 42 table 30. si gnal listing in order by pin/ball number ................................ ................... 46 table 31. signal listing in order by signal name ................................ ........................ 50 table 32. voltage and no - connect pin/ball locations ................................ ................. 52 table 33. power specifications for mobile pentium iii processor with intel speedstep technology ................................ ................................ ............................... 54 table 34. thermal diode interface ................................ ................................ ............. 55 table 35. thermal diode specifications ................................ ................................ ..... 55 tab le 36. bsel[1:0] encoding ................................ ................................ ................... 60 table 37. voltage identification encoding ................................ ................................ ... 68 table 38. input signals ................................ ................................ .............................. 69
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz 245483 - 002 data sheet v table 39. output signals ................................ ................................ ........................... 70 table 4 0. input/output signals (single driver) ................................ ............................ 70 table 41. input/output signals (multiple driver) ................................ .......................... 70 table 42. pll filter inductor recommendations ................................ ......................... 72 table 43. pll filter c apacitor recommendations ................................ ....................... 73 table 44. pll filter resistor recommendations ................................ ......................... 73
mobile pentium? iii processor i n bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz datasheet 245483 - 002 vi revision history date revision number updates april 2000 1.0 initial release june 2000 2.0 revision 2.0 updates in clude: added new processor speed 750/600 mhz added new low - voltage processor speed 600/500 mhz updated references
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz 245483 - 002 datasheet 1 1.0 introduction using intel?s advanced 0.18 - micron process technology, the int el? mobile penti um? iii processor offers high performance a nd lower power consumption. key performance advancements include the addition of new internet streaming simd instructions, advanced transfer cache architecture, and a processor system bus speed of 100 mhz. these features are offered in bga2 and micro - pga 2 packages, which are up to 20% smaller than those offered for the intel mobile pentium ii processor. all of these technologies make outstanding performance possible for mobile pcs in a variety of shapes and sizes. intel mobile p entium iii processor featuring intel speedste p? technology is the next dramatic step towards achieving near desktop performance. this exciting new processor has two performance modes and allows real - time dynamic switching of the voltage and frequency between the modes. this occurs by switching th e bus ratios, core operating voltage, and core processor speeds without resetting the system. the integrated l2 cache is designed to help improve performance, and it complements the system bus by providing critical data fas ter and reducing total system power consumption. the mobile pentium iii processor?s 64 - bit wide gunning transceiver logic (gtl+) system bus provides a glue - less, point - to - point interface for an i/o bridge/memory controller, and is compatible with the 440bx agpset , 440zx - m agpset, and the 440mx chipset. figure 1 shows the various parts of a mobile pentium iii processor/440bx or 440zx - m agpset - based system and how the mobile pentium iii processor connects to them. figure 2 shows an alternative mobile pentium iii processor/440mx chipset - based system. this document provides the electrical, mechanical, and thermal specifications for the mobile pentium iii processor featuring i ntel speedstep technology at 750 mhz and 700 mhz in bga2 and micro - pga2 packages, and 600 - mhz low voltage in the bga2 package .
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz datas heet 245483 - 002 2 figure 1 . signal groups of a mobile pentium iii processor/440bx agpset - based system mobile pentium ? iii processor 443bx or 440zx-m north bridge piix4e south bridge pci ioapic ( optional) isa/eio tap apic bus cmos/ open drain dram system bus thermal sensor smbus system controller v0000-03 or
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz 245483 - 002 datasheet 3 figure 2 . signal groups of a mobile pentium iii processor/440mx chipset - based system mobile pentium ? iii processor 440mx pciset pci x-bus tap cmos/ open drain dram system bus thermal sensor smbus system controller v0000-04 or
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz datas heet 245483 - 002 4 1.1 overview performance improved over existing mobile processors ? supports the intel architecture with dynami c execution ? supports the intel architecture mmx? technology ? supports streaming simd extensions for enhanced video, sound, and 3d performance ? supports intel speedstep technology ? integrated intel floating point unit compatible with the ieee 754 standard on - die primary (l1) inst ruction and data caches ? 4 - way set associative, 32 - byte line size, 1 line per sector ? 16 - kbyte instruction cache and 16 - kbyte write - back data cache ? cacheable range controlled by processor programmable registers on - die second level (l2) cache ? 8 - way set associ ative, 32 - byte line size, 1 line per sector ? operates at full core speed ? 256 - kbyte, ecc protected cache data array gtl+ system bus interface ? 64 - bit data bus, 100 - mhz operation ? uniprocessor, two loads only (processor and i/o bridge/memory controller) ? integra ted termination pentium ii processor clock control ? quick start for low power, low exit latency clock ?throttling? ? deep sleep mode for lower power dissipation thermal diode for measuring processor temperature 1.2 terminology term definition # a ?#? symbol foll owing a signal name indicates that the signal is active low. this means that when the signal is asserted (based on the name of the signal) it is in an electrical low state. otherwise, signals are driven in an electrical high state when they are asserted. i n state machine diagrams, a signal name in a condition indicates the condition of that signal being asserted ! indicates the condition of that signal not being asserted. for example, the condition ?!stpclk# and hs? is equivalent to ?the active low signal stpclk# is unasserted (i.e., it is at 1.5v) and the hs condition is true.? l electrical low signal levels h electrical high signal levels 0 logical low. for example, bd[3:0] = ?1010? = ?hlhl? refers to a hexadecimal ?a,? and d[3:0]# = ?1010? = ?lhlh? a lso refers to a hexadecimal ?a.? 1 logical high. for example, bd[3:0] = ?1010? = ?hlhl? refers to a hexadecimal ?a,? and d[3:0]# = ?1010? = ?lhlh? also refers to a hexadecimal ?a.? x ?don?t care? condition
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz 245483 - 002 datasheet 5 1.3 references pentium ? ii processor at 233 mhz, 266 mhz, 300 mhz, and 333 mhz (order number 243335) pentium ? ii processor 350 mhz and 400 mhz (order number 243657) pentium ? ii processor developer?s manual (order number 243502) ck97 clock driver specification (contact your intel field sales representati ve) intel ? architecture software developer?s manual (order number 243193) ? volume i: basic architecture (order number 243190) ? volume ii: instruction set reference (order number 243191) ? volume iii : system programming guide (order number 243192) mobile pentiu m? iii processor i/o buffer models , ibis format (available in electronic form; contact your intel field sales representative) mobile pentium? iii processor gtl+ system bus layout guideline (contact your intel field sales representative)
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz datas heet 245483 - 002 6 2.0 mobile pentium iii processor features 2.1 new features in the mobile pentium iii processor 2.1.1 on - die gtl+ termination the termination resistors for the gtl+ system bus are integrated onto the processor die. the reset# signal does not have on - die termination and requires an externa l 56.2 w 1% terminating resistor. 2.1.2 streaming simd extensions the mobile pentium iii processor is the first mobile processor to implement streaming simd (single instruction, multiple data) extensions. streaming simd extensions can enhance floating point, video, so und, and 3 - d application performance. 2.1.3 intel speedstep technology intel speedstep technology is a new mobile feature developed by intel. the mobile pentium iii processors that are enabled with intel speedstep technology have the ability to switch between tw o bus ratios and core speeds without having to reset the processor. 2.1.4 signal differences between the mobile pentium ii processor and the mobile pentium iii processor with the exception of bclk, picclk, and pwrgood, the cmos inputs and open - drain outputs hav e changed from 2.5v tolerant, as on the mobile pentium ii processor to 1.5v tolerant. table 1 . new mobile pentium iii processor signals signals function clkref system bus clock trip point control cmosref 1.5v cmos input buffer tri p point control edgectrlp gtl+ output buffer control ghi# intel speedstep technology operating mode selection bsel[1:0] processor system bus speed selection rsvd reserved, may be defined in the future rttimpedp on - die gtl+ termination control vcct on - die gtl+ termination current supply vid[4:0] voltage identification table 2 . removed mobile pentium ii processor signals signals purpose edgectrln gtl+ output buffer control bsel 100/66 mhz processor system bus speed selection
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz 245483 - 002 datasheet 7 2.2 power management 2.2.1 clock control architecture the mobile pentium iii processor clock control architecture ( figure 3 ) has been optimized for leading edge deep green desktop and mobile computer designs. the clock con trol architecture consists of seven different clock states: normal, stop grant, auto halt, quick start, halt/grant snoop, sleep, and deep sleep states. the auto halt state provides a low - power clock state that can be controlled through the software executi on of the hlt instruction. the quick start state provides a very low power and low exit latency clock state that can be used for hardware controlled ?idle? computer states. the deep sleep state provides an extremely low - power state that can be used for ?po wer - on - suspend? computer states, which is an alternative to shutting off the processor?s power. compared to the pentium processor exit latency of 1 ms, the exit latency of the deep sleep state has been reduced to 30 m sec in the mobile pentium iii processor . the stop grant and sleep states shown in figure 3 are intended for use in ?deep green? desktop and server systems ? not in mobile systems. performing state transitions not shown in figure 3 is neither recommended nor supported. the stop grant and quick start clock states are mutually exclusive, i.e., a strapping option on signal a15# chooses which state is entered when the stpclk# signal is asserted. the quick start state is enabled by strapping the a15# signal to ground at reset; otherwise, asserting the stpclk# signal puts the processor into the stop grant state. the stop grant state has a higher power level than the quick start state and is designed for symmetric multi - p rocessing (smp) platforms. the quick start state has a much lower power level, but it can only be used in uniprocessor platforms. table 3 provides clock state characteristics, which are described in detail in the f ollowing sections. 2.2.2 normal state the normal state of the processor is the normal operating mode where the processor?s core clock is running and the processor is actively executing instructions. 2.2.3 auto halt state this is a low - power mode entered by the proces sor through the execution of the hlt instruction. the power level of this mode is similar to the stop grant state. a transition to the normal state is made by a halt break event (one of the following signals going active: nmi, intr, binit#, init#, reset#, flush#, or smi#). asserting the stpclk# signal while in the auto halt state will cause the processor to transition to the stop grant or quick start state, where a stop grant acknowledge bus cycle will be issued. deasserting stpclk# will cause the processor to return to the auto halt state without issuing a new halt bus cycle. the smi# interrupt is recognized in the auto halt state. the return from the system management interrupt (smi) handler can be to either the normal state or the auto halt state. see th e intel? architecture software developer?s manual, volume iii: system programmer?s guide for more information. no halt bus cycle is issued when returning to the auto halt state from the system management mode (smm). the flush# signal is serviced in the aut o halt state. after the on - chip and off - chip caches have been flushed, the processor will return to the auto halt state without issuing a halt bus cycle.
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz datas heet 245483 - 002 8 transitions in the a20m# and preq# signals are recognized while in the auto halt state. figure 3 . clock control states halt/grant snoop normal hs=false stop grant auto halt hs=true quick start sleep deep sleep (!stpclk# and !hs) or stop break stpclk# and !qse and sga snoop occurs snoop serviced stpclk# and qse and sga (!stpclk# and !hs) or reset# snoop serviced snoop occurs !stpclk# and hs stpclk# and !qse and sga hlt and halt bus cycle halt break snoop serviced snoop occurs stpclk# and qse and sga !stpclk# and hs !slp# or reset# slp# bclk stopped bclk on and !qse bclk stopped bclk on and qse v0001-00 notes: halt break ? a20m#, binit#, flush#, init#, intr, nmi, preq#, reset#, smi# hlt ? hlt instruction executed hs ? processor halt state qse ? quick start state enabled sga ? stop grant acknowledge bus cycle issued stop break ? binit#, reset# 2.2.4 stop grant state the processor enters this mode with the assertion of the stpclk# signal when it is configured for stop grant state (via the a15# strapping option). the processor is still able to respond to snoop reques ts and latch interrupts. latched interrupts will be serviced when the processor returns to the normal state. only one occurrence of each interrupt event will be latched. a transition back to the normal state can be made by the deassertion of the stpclk# si gnal or the occurrence of a stop break event (a binit# or reset# assertion). the processor will return to the stop grant state after the completion of a binit# bus initialization unless stpclk# has been de - asserted. reset# assertion will cause the process or to immediately initialize itself, but the processor will stay in the stop grant state after initialization until stpclk# is deasserted. a transition to the sleep state can be made by the assertion of the slp# signal.
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz 245483 - 002 datasheet 9 while in the stop grant state, asse rtions of flush#, smi#, init#, intr, and nmi (or lint[1:0]) will be latched by the processor. these latched events will not be serviced until the processor returns to the normal state. only one of each event will be recognized upon return to the normal sta te. 2.2.5 quick start state this is a mode entered by the processor with the assertion of the stpclk# signal when it is configured for the quick start state (via the a15# strapping option). in the quick start state the processor is only capable of acting on sno op transactions generated by the system bus priority device. because of its snooping behavior, quick start can only be used in a uniprocessor (up) configuration. a transition to the deep sleep state can be made by stopping the clock input to the processor . a transition back to the normal state (from the quick start state) is made only if the stpclk# signal is deasserted. while in this state the processor is limited in its ability to respond to input. it is incapable of latching any interrupts, servicing sn oop transactions from symmetric bus masters or responding to flush# or binit# assertions. while the processor is in the quick start state, it will not respond properly to any input signal other than stpclk#, reset#, or bpri#. if any other input signal chan ges, then the behavior of the processor will be unpredictable. no serial interrupt messages may begin or be in progress while the processor is in the quick start state. reset# assertion will cause the processor to immediately initialize itself, but the pr ocessor will stay in the quick start state after initialization until stpclk# is deasserted. 2.2.6 halt/grant snoop state the processor will respond to snoop transactions on the system bus while in the auto halt, stop grant, or quick start state. when a snoop tr ansaction is presented on the system bus the processor will enter the halt/grant snoop state. the processor will remain in this state until the snoop has been serviced and the system bus is quiet. after the snoop has been serviced, the processor will retur n to its previous state. if the halt/grant snoop state is entered from the quick start state, then the input signal restrictions of the quick start state still apply in the halt/grant snoop state, except for those signal transitions that are required to pe rform the snoop. 2.2.7 sleep state the sleep state is a very low - power state in which the processor maintains its context and the phase - locked loop (pll) maintains phase lock. the sleep state can only be entered from the stop grant state. after entering the stop grant state, the slp# signal can be asserted, causing the processor to enter the sleep state. the slp# signal is not recognized in the normal or auto halt states. the processor can be reset by the reset# signal while in the sleep state. if reset# is driv en active while the processor is in the sleep state then slp# and stpclk# must immediately be driven inactive to ensure that the processor correctly initializes itself. input signals (other than reset#) may not change while the processor is in the sleep st ate or transitioning into or out of the sleep state. input signal changes at these times will cause unpredictable behavior. thus, the processor is incapable of snooping or latching any events in the sleep state.
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz datas heet 245483 - 002 10 while in the sleep state, the processor can enter its lowest power state, the deep sleep state. removing the processor?s input clock puts the processor in the deep sleep state. picclk may be removed in the sleep state. 2.2.8 deep sleep state the deep sleep state is the lowest power mode the processor can enter while maintaining its context. the deep sleep state is entered by stopping the bclk input to the processor, while it is in the sleep or quick start state. for proper operation, the bclk input should be stopped in the low state. the processor will re turn to the sleep or quick start state from the deep sleep state when the bclk input is restarted. due to the pll lock latency, there is a delay of up to 30 m sec after the clocks have started before this state transition happens. picclk may be removed in the deep sleep state. picclk should be designed to turn on when bclk turns on when transitioning out of the deep sleep state. the input signal restrictions fo r the deep sleep state are the same as for the sleep state, except that reset# assertion will result in unpredictable behavior. table 3 . clock state characteristics clock state exit latency snooping? system uses normal n/a yes norm al program execution auto halt approximately 10 bus clocks yes s/w controlled entry idle mode stop grant 10 bus clocks yes h/w controlled entry/exit mobile throttling quick start through snoop, to halt/grant snoop state: immediate through stpclk#, to normal state: 8 bus clocks yes h/w controlled entry/exit mobile throttling halt/grant snoop a few bus clocks after the end of snoop activity yes supports snooping in the low power states sleep to stop grant state 10 bus clocks no h/w controlled entry/e xit desktop idle mode support deep sleep 30 m sec no h/w controlled entry/exit mobile powered - on suspend support note: see table 33 for power dissipation in the low - power states. 2.2.9 operating system implications of low - power states there are a number of architectural features of the mobile pentium iii processor that do not function in the quick start or sleep state as they do in the stop grant state. the time - stamp counter and the performance monitor counters are not guaranteed to count in the quick start or sleep states. the local a pic timer and performance monitor counter interrupts should be disabled before entering the deep sleep state or the resulting behavior will be unpredictable. 2.2.10 intel speedstep technology some mobile pentium iii processors will be offered with intel speedstep technology. intel speedstep technology enables the processor to switch between two core frequencies, without resetting the processor or changing the system bus frequency. the processor has two bus ratios programmed into it instead of one and the ghi# sign al controls which one is used. after reset, the
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz 245483 - 002 datasheet 11 processor will start in the lower of its two core frequencies, the ?battery optimized? mode. an operating mode transition to the high core frequency can be made by putting the processor into the deep sleep st ate, raising the core voltage, setting ghi# low, and returning to the normal state. this puts the processor into the ?maximum performance? mode. a t ransition back to the low - core frequency can be made by reversing these steps. for any other questions rega rding intel speedstep technology, contact your intel field representative for more information. 2.3 gtl+ signals the mobile pentium iii processor system bus signals use a variation of the low - voltage swing gtl signaling technology. the mobile pentium iii proce ssor system bus specification is similar to the pentium ii processor system bus specification, which is a version of gtl with enhanced noise margins and less ringing. the gtl+ system bus depends on incident wave switching and uses flight time for timing c alculations of the gtl+ signals, as opposed to capacitive derating. analog signal simulation of the system bus including trace lengths is highly recommended. contact your field sales representative to receive the ibis models for the mobile pentium iii proc essor. the gtl+ system bus of the pentium ii processor was designed to support high - speed data transfers with multiple loads on a long bus that behaves like a transmission line. however, in mobile systems the system bus only has two loads (the processor a nd the chipset) and the bus traces are short. it is possible to change the layout and termination of the system bus to take advantage of the mobile environment using the same gtl+ i/o buffers. in mobile systems the gtl+ system bus is terminated at one end only. this termination is provided on the processor core (except for the reset# signal). refer to the mobile pentium iii processor gtl+ system bus layout guideline for details on laying out the gtl+ system bus. 2.4 mobile pentium iii processor cpuid the cpuid instruction does not distinguish between the pentium iii processor and the mobile pentium iii processor. after a power - on reset or when the cpuid version information is loaded, the eax register contains the values shown in table 4 . after the l2 cache is initialized, the cpuid cache/tlb descriptors will be the values shown in table 5 . table 4 . mobile pentium iii processor cpuid eax[31:0] ebx[7:0] res erved [31:14] type [13:12] family [11:8] model [7:4] stepping [3:0] brand id x 0 6 8 x 02 table 5 . mobile pentium iii processor cpuid cache and tlb descriptors cache and tlb descriptors 01h, 02h, 03h, 04h, 08h, 0ch, 82h
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz datas heet 245483 - 002 12 3.0 electrica l specifications 3.1 processor system signals table 6 lists the processor system signals by type. all gtl+ signals are synchronous with the bclk signal. all tap signals are synchronous with the tck signal except trst#. all cmos input signals can be applied asynchronously. table 6 . system signal groups group name signals gtl+ input bpri#, defer#, reset#, rs[2:0]#, rsp#, trdy# gtl+ output prdy# gtl+ i/o a[35:3]#, ads#, aerr#, ap[1:0]#, berr#, bi nit#, bnr#, bp[3:2]#, bpm[1:0]#, breq0#, d[63:0]#, dbsy#, dep[7:0]#, drdy#, hit#, hitm#, lock#, req[4:0]#, rp# 1.5v cmos input 2 a20m#, flush#, ghi#, ignne#, init#, lint0/intr, lint1/nmi, preq#, slp#, smi#, stpclk# 2.5v cmos input 1, 3 pwrgood 1.5v open drain output 2 ferr#, ierr# 3.3v cmos input 4 bsel[1:0] clock 3 bclk apic clock 3 picclk apic i/o 2 picd[1:0] thermal diode thermda, thermdc tap input 2 tck, tdi, tms, trst# tap output 2 tdo power/other 5 clkref, cmosref, edgectrlp, nc, pll1, pll2, rsvd, rttimpedp, testhi, testlo[2:1], v cc , v cct , vid[4:0], v ref , v ss notes: 1. see section 8.1 for information on the pwrgood signal. 2. these signals are tolerant to 1.5v only. see table 7 for the recommended pull - up resistor. 3. these signals are tolerant to 2.5v only. see table 7 for the recommended pull - up resistor. 4. these signals are tolerant to 3.3v only. see table 7 for the recommended pull - up resistor. 5. v cc is the power supply for the core logic. pll1 and pll2 are the power supply for the pll analog section. v cct is the power supply for the system bus buffers. v ref is the voltage refere nce for the gtl+ input buffers. v ss is system ground. the cmos, apic, and tap inputs can be driven from ground to 1.5v. bclk, picclk, and pwrgood can be driven from ground to 2.5v. the apic data and tap outputs are open - drain and should be pulled up to 1. 5v using resistors with the values shown in table 7 . if open - drain drivers are used for input signals, then they should also be pulled up to the appropriate voltage using resistors with the values shown in table 7 .
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz 245483 - 002 datasheet 13 table 7 . recommended resistors for mobile pentium iii processor signals recommended resistor value ( w ) mobile pentium iii processor signal 1,2 notes no pull - up ghi# note 3 10 pull - down breq0# note 4 56.2 pull - up reset# note 5 150 pull - up picd[1:0], tdi, tdo 270 pull - up smi# 680 pull - up stpclk# 1k pull - up init#, tck, tms 1k pull - down trst# 1.5k pull - up a20m#, ferr#, flush#, ierr#, ignne#, lint0/intr, lint1/nmi, preq#, pwrgood, slp# notes: 1. the recommendations above are only for signals that are being used. these recommendations are maximum values only; stronger pull - ups may be used. pull - ups for the signals driven by the chipset should not violate the chipset specification. refer to section 3.1.4 for the required pull - up or pull - down resistors for signals that are not being used. 2. open - drain signals must n ever violate the undershoot specification in section 4.3 . use stronger pull - ups if there is too much undershoot. 3. ghi# has an on - die pull - up to v cct . 4. a pull - down on breq0# is an alternative to having the central agen t to drive breq0# low at reset . 5. a 56.2 - w, 1 - % terminating resistor connected to v cct is required. 3.1.1 power sequencing requirements the mobile pentium iii processor has no power sequencing requirements. intel recommends that all of the processor power planes rise to their specified values within on e second of each other. the v cc power plane must not rise too fast. at least 200 m sec (t r ) must pass from the time that v cc is at 10% of its nominal value until the time that v cc is at 90% of its nominal value (see figure 4 ). figure 4 . vcc ramp rate requirement vcc volts 90% vcc (nominal) 10% vcc (nominal) t r time 3.1.2 test access port (tap) connection the tap interface is an implementation of the ieee 1149.1 (?jtag?) standard. due to the voltage levels supported by the tap interface, intel recommends that the mobile pentium iii processor and the other 1.5 - v jtag specification compliant devices be last in the jtag chain after any devices with 3.3 - v or 5.0 - v jtag interfaces within the system. a translation buffer
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz datas heet 245483 - 002 14 should be used to reduce the tdo output voltage of the last 3.3/5.0v device down to the 1.5 - v range that the mobile pentium iii processor can tolerate. multiple copies of tms and trst# must be provided, one for each voltage level. a debug port and connector may be placed at the start and end of the jtag chain containing the processor, with tdi to the first component coming from the debug port and tdo from the last component going to the debug port. there are no requirements for placing the mobile pentium iii process or in the jtag chain, except for those that are dictated by voltage requirements of the tap signals. 3.1.3 catastrophic thermal protection the mobile pentium iii processor does not support catastrophic thermal protection or the thermtrip# signal. an external the rmal sensor must be used to protect the processor and the system against excessive temperatures. 3.1.4 unused signals all signals named nc and rsvd must be unconnected. the testhi signal should be pulled up to v cct . the testlo1 and testlo2 signal should be pulle d down to v ss . unused gtl+ inputs, outputs, and bi - directional signals should be unconnected. unused cmos active low inputs should be connected to v cct and unused active high inputs should be connected to v ss . unused open - drain outputs should be unconnecte d. if the processor is configured to enter the quick start state rather than the stop grant state, then the slp# signal should be connected to v cct . when tying any signal to power or ground, a resistor will allow for system testability. for unused signals, intel suggests that 1.5 - k w resistors are used for pull - ups and 1 - k w resistors are used for pull - downs. if the local apic is hardware disabled, then picclk and picd[1:0] should be tied to v ss with a 1 - k w resistor, one resistor can be used for the three si gnals. otherwise picclk must be driven with a clock that meets specification (see table 18 ) and the picd[1:0] signals must be pulled up to v cct with 150 - w resistors, even if the local apic is not used. bsel1 must b e connected to v ss and bsel0 must be pulled up to v cct . vid[4:0] should be connected to v ss if they are not used. if the tap signals are not used then the inputs should be pulled to ground with 1 - k w resistors and tdo should be left unconnected. 3.1.5 signal stat e in low - power states 3.1.5.1 system bus signals all of the system bus signals have gtl+ input, output, or input/output drivers. except when servicing snoops, the system bus signals are tri - stated and pulled up by the termination resistors. snoops are not permitte d in the sleep and deep sleep states. 3.1.5.2 cmos and open - drain signals the cmos input signals are allowed to be in either the logic high or low state when the processor is in a low - power state. in the auto halt and stop grant states these signals are allowed to toggle.
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz 245483 - 002 datasheet 15 these input buffers have no internal pull - up or pull - down resistors and system logic can use cmos or open - drain drivers to drive them. the open - drain output signals have open drain drivers and external pull - up resistors are required. one of the tw o output signals (ierr#) is a catastrophic error indicator and is tri - stated (and pulled - up) when the processor is functioning normally. the ferr# output can be either tri - stated or driven to v ss when the processor is in a low - power state depending on the condition of the floating - point unit. since this signal is a dc current path when it is driven to v ss , intel recommends that the software clears or masks any floating - point error condition before putting the processor into the deep sleep state. 3.1.5.3 other signa ls the system bus clock (bclk) must be driven in all of the low - power states except the deep sleep state. the apic clock (picclk) must be driven whenever bclk is driven unless the apic is hardware disabled or the processor is in the sleep state. otherwise, it is permitted to turn off picclk by holding it at v ss . the system bus clock should be held at v ss when it is stopped in the deep sleep state. in the auto halt and stop grant states the apic bus data signals (picd[1:0]) may toggle due to apic bus message s. these signals are required to be tri - stated and pulled - up when the processor is in the quick start, sleep, or deep sleep states unless the apic is hardware disabled. 3.2 power supply requirements 3.2.1 decoupling recommendations the amount of bulk decoupling req uired on the v cc and v cct planes to meet the voltage tolerance requirements for the mobile pentium iii processor are a strong function of the power supply design. contact your intel field sales representative for tools to help determine how much bulk decou pling is required. for a processor with maximum performance mode at 700 mhz and above, intel recommends the following decoupling. the processor core power plane (v cc ) should have fifteen 0.68 - m f 0603 ceramic capacitors (using x74 dielectric for thermal reasons) placed directly under the package using two vias for power and two vias for ground to reduce the trace inductance. also to minimize inductance, traces to those vias should be 22 mils (in width) from the capacitor pads to match the via - pad size (assuming 22 - mil pad size). twenty - four 2.2 - m f, 0805 mid - frequency decoupling capacitors should be placed around the die as close to the die as flex solution allows. the system bus buffer power plan e (v cct ) should have twenty 0.1 - m f high - frequency decoupling capacitors around the die. for a processor with maximum performance mode at 650 mhz and below, the following decoupling is recommended. the processor core power plan (v cc ) should have twelve 0. 1 - m f, high - frequency decoupling capacitors placed underneath the die and twenty - seven 0.1 - m f, mid - frequency decoupling capacitors placed around the die as close to the die (< 0.8 inches away) as flex solution allows. the system bus buffer power plane (v cct ) should have fifteen 0.1 - m f, high - frequency decoupling capacitors no further than 0.25 inches away from the v cct vias (balls).
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz datas heet 245483 - 002 16 3.2.2 voltage planes all v cc and v ss pins/balls must be connected to the appropriate voltage plane. all v cct and v ref pins/balls must be connected to the appropriate traces on the system electronics. in addition to the main v cc , v cct , and v ss power supply signals, pll1 and pll2 provide analog decoupling to the pll section. pll1 and pll2 should be connected according to figure 5 . do not connect pll2 directly to v ss . appendix a contains the rlc filter specification. figure 5 . pll rlc filter pll1 pll2 v cct v0027-01 l1 c1 r1 3.3 system bus clock and processor clocking the 2.5 - v bclk c lock input directly controls the operating speed of the system bus interface. all system bus timing parameters are specified with respect to the rising edge of the bclk input. the mobile pentium iii processor core frequency is a multiple of the bclk freque ncy. the processor core frequency is configured during manufacturing. the configured bus ratio is visible to software in the power - on configuration register. see section 7.2 for details. multiplying the bus clock fr equency is necessary to increase performance while allowing for easier distribution of signals within the system. clock multiplication within the processor is provided by the internal phase lock loop (pll), which requires a constant frequency bclk input. d uring reset or on exit from the deep sleep state, the pll requires some amount of time to acquire the phase of bclk. this time is called the pll lock latency, which is specified in section 3.7 , ac timing parameters t18 and t47. 3.4 intel speedstep technology the mobile pentium iii processor featuring intel speedstep technology is specified to operate in either of two modes, the ?maximum performance mode? or the ?battery optimized mode?. each frequency and voltage pair i dentifies the operating mode. the voltage provided to the processor must meet the core voltage specification for the current operating mode. if an operating mode transition is made, then the system logic must direct the voltage regulator to regulate to the voltage specification of the other mode. after reset, the processor will start in the lower of its two core frequencies, so the core voltage must meet the lower voltage specification. any reset# assertion will force the processor to the lower frequency, a nd the core voltage must behave appropriately. init# assertions ("soft" resets) and apic bus init messages do not change the operating mode of the processor. some electrical and thermal specifications are for a specific voltage and frequency. the mobile p entium iii processor featuring intel speedstep technology will meet the electrical and thermal specifications specific to the current operating mode, and it is not guaranteed to meet the electrical and thermal specifications specific to the opposite operat ing mode. the timing specifications in table 22 must be met when performing an operating mode transition .
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz 245483 - 002 datasheet 17 3.5 maximum ratings table 8 contains the mobile pentium iii processor stress ratings. functional operation at the absolute maximum and minimum is neither implied nor guaranteed. the processor should not receive a clock while subjected to these conditions. functional operating conditions are provided in the ac and dc tables. extended exposure to the maximum ratings may affect device reliability. furthermore, although the processor contains protective circuitry to resist damage from static electric discharge, one should always take precautions to avoid high static voltages or e lectric fields. table 8 . mobile pentium iii processor absolute maximum ratings symbol parameter min max unit notes t storage storage temperature ? 40 85 c note 1 v cc (abs) supply voltage with respect to v ss ? 0.5 2.1 v v cct system bus buffer voltage with respect to v ss ? 0.3 2.1 v v in gtl system bus buffer dc input voltage with respect to v ss ? 0.3 2.1 v notes 2, 3 v in gtl system bus buffer dc input voltage with respect to v cct ? v cct + 0.7v v notes 2, 4 v in15 1.5v buffer dc inpu t voltage with respect to v ss ? 0.3 2.1 v note 5 v in25 2.5v buffer dc input voltage with respect to v ss ? 0.3 3.3 v note 6 v in33 3.3v buffer dc input voltage with respect to v ss ? 0.3 3.5 v note 7 v invid vid ball/pin dc input voltage with respect to v ss ? 5.5 v i vid vid current 5 ma note 8 notes: 1. the shipping container is only rated for 65c. 2. parameter applies to the gtl+ signal groups only. compliance with both v in gtl specifications is required. 3. the voltage on the gtl+ signals must never be below ? 0.3 or a bove 2.1v with respect to ground. 4. the voltage on the gtl+ signals must never be above v cct + 0.7v even if it is less than v ss + 2.1v, or a short to ground may occur. 5. parameter applies to cmos, open - drain, apic, and tap bus signal groups only. 6. parameter app lies to bclk, clkref, picclk and pwrgood signals. 7. parameter applies to bsel[1:0] signals. 8. parameter applies to each vid pin/ball individually. 3.6 dc specifications table 9 through table 12 lists the dc specifications for the mobile pentium iii processor. specifications are valid only while meeting specifications for the junction temperature, clock frequency, and input voltages. care should be taken to read all notes associated with each parameter.
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz datas heet 245483 - 002 18 table 9 . mobile pentium iii processor power specifications 1 t j = 0c to 100c; v cc = 1.10v 80 mv; v cc = 1.35v 100 mv or 1.60v 115 mv; v cct = 1.50v 115 mv symbol parameter min typ max unit notes v cc trans ient v cc for core logic 1.02 1.25 1.485 1.10 1.35 1.60 1.18 1.45 1.715 v v v 80 mv 100 mv 115 mv, note 7 v cc,dc static v cc for core logic 1.02 1.25 1.485 1.10 1.35 1.60 1.18 1.45 1.640 v v v 80 mv 100 mv - 115/+40 mv, note 2 v cct v cc for system bus b uffers, transient tolerance 1.385 1.50 1.615 v 115 mv, note 7 v cct,dc v cc for system bus buffers, static tolerance 1.455 1.50 1.545 v 3%, note 2 i cc current for v cc at core frequency at 500 mhz & 1.10v at 550 mhz & 1.35v at 600 mhz & 1.35v at 700 mhz & 1.60v at 750 mhz & 1.60v 7.9 10.3 11.2 14.6 15.6 a a a a a notes 4 i cct current for v cct 2.5 a notes 3, 4 i cc,sg processor stop grant and auto halt current at 1.10v at 1.35v at 1.60v 1.5 1. 7 2.2 a a a notes 4 i cc,qs processor quick start and sleep current at 1.10v at 1.35v at 1.60v 1.3 1.5 1.9 a a a note 4 i cc,dslp processor deep sleep leakage current at 1.10v at 1.35v at 1.60v 1.1 1.2 1.6 a a a notes 4 di cc /dt v cc power supply current slew rate 1400 a/ m s notes 5, 6 notes: 1. unless otherwise noted, all specifications in this table apply to all processor frequencies. 2. static voltage regulation includes: dc output initial voltage set point adjust, output ripple and noise, o utput load ranges specified in table 9 above, temperature, and warm up. 3. i cct is the current supply for the system bus buffers, including the on - die termination. 4. i ccx,max specifications are specified at v cc, dc max , v cct,max , and 100c and under maximum signal loading conditions. 5. based on simulations and averaged over the duration of any change in current. use to compute the maximum inductance and reaction time of the voltage regulator. this parameter is not tested. 6. maximum values specified by design/characterization at nominal v cc and v cct . 7. v ccx must be within this range under all operating conditions, including maximum current transients. v ccx must return to within the static voltage specification, v ccx,dc , within 100 m s after a transient event. the average of v ccx over time must not exceed 1.65v, as an arbitrarily large time span may be used for this average. the signals on the mobile pentium iii processor system bus are included in the gtl+ signal group. these si gnals are terminated to v cc . the dc specifications for these signals are listed in table 10, and the termination and reference voltage specifications for these signals are listed in table 11 . the mobile pentium iii processor requires external termination and a v ref . refer to the mobile pentium iii processor gtl+ system bus layout guideline for full details of system v cct and v ref requirements. the cmos, open - drain, and tap signals are designed to interface at 1.5 - v levels to allow connection to other devices. bclk and picclk are designed to receive a 2.5 - v clock signal. the dc specifications for these signals are listed table 12 .
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz 245483 - 002 datasheet 19 table 10 . gtl+ signal group dc specifications t j = 0c to 100c; v cc = 1.10v 80 mv; v cc = 1.35v 100 mv or 1.60v 115 mv; v cct = 1.50v 115 mv symbol parameter min max unit notes v oh output high voltage ? ? v see v cct,max in table 11 r on output low drive strength 16.67 w i l leakage current for inputs, outputs and i/os 100 m a note 1 note: (0 v in/out v cct ). table 11 . gtl+ bus dc specifications t j = 0 c to 100 c; v cc = 1.10v 80 mv; v cc = 1.35v 100 mv or 1.60v 115 mv; v cct = 1.50v 115 mv symbol parameter min typ max unit notes v cct bus termination voltage 1.385 1.5 1.615 v note 1 v ref input reference voltage 2 / 3 v cct ? 2% 2 / 3 v cct 2 / 3 v cct + 2% v 2%, note 2 r tt bus termination strength 50 56 65 w on - die r tt , note 3 notes: 1. for simulation use 1.50v 10%. for typical simulation conditions use v cctmin (1.5v ? 10%). 2. v ref should be created from v cct by a voltage divider. 3. the reset# signal does not have an on - die r tt . it requires an off - die 56.2 w 1% terminat ing resistor connected to v cct .
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz datas heet 245483 - 002 20 table 12 . clock, apic, tap, cmos, and open - drain signal group dc specifications t j = 0 c to 100 c; v cc = 1.10v 80 mv; v cc = 1.35v 100 mv or 1.60v 115 mv; v cct = 1.50v 115 mv symbol parameter min max unit notes v il15 input low voltage, 1.5v cmos ? 0.15 v cmosrefmin ? 200 mv v v il25 input low voltage, 2.5v cmos ? 0.3 0.7 v notes 1, 2 v il33 input low voltage, 3.3v cmos ? 0.3 v cmosrefmin ? 200 mv v notes 7 v il,bclk input low voltage, bclk ? 0.3 0. 5 v note 2 v ih15 input high voltage, 1.5v cmos v cmosrefmax + 200 mv v cct v v ih25 input high voltage, 2.5v cmos 2.0 2. 625 v notes 1, 2 v ih33 input high voltage, 3.3v cmos v cmosrefmax + 200 mv 3.465 v notes 7 v ih,bclk input high voltage, bclk 2.0 2.625 v note 2 v ol output low voltage 0.4 v note 3 v oh15 output high voltage, 1.5v cmos n/a 1.615 v all outputs are open - drain v oh25 output high voltage, 2.5v cmos n/a 2.625 v all outputs are open - drain v oh,vid output high voltage, vid ball/pins n/a 5.50 v 5v + 10% v cmosref cmosref voltage 0.90 1.10 v note 4 v clkref clkref voltage 1.175 1.325 v 1.25v 6% 4 i ol output l ow current 10 ma note 6 i l leakage current for inputs, outputs and i/os 100 m a note 5, note 8 notes: 1. parameter applies to the picclk and pwrgood signals only. 2. v ilx,min and v ihx,max only apply when bclk and picclk are stopped. bclk and picclk should be stopped in the low state. see table 23 for the bclk voltage range specifications for when bclk is running. see table 24 for the picclk voltage range specifications for when picclk is running. 3. parameter measured at 10 ma. 4. v cmosref and v clkref should be creat ed from a stable voltage supply using a voltage divider. 5. (0 vin/out v ihx,max ). 6. specified as the minimum amount of current that the output buffer must be able to sink. however, v ol,max cannot be guaranteed if this specification is exceeded. 7. parameter ap plies to bsel[1:0] signals only. 8. for bsel[1:0] signals, i l, max can be up to 100 m a (with 1k pull - up to 1.5v), and can be upto 500 m a (with 1k pull - up to 3.3v). 3.7 ac specifications 3.7.1 system bus, clock, apic, tap, cmos, and open - drain ac specifications table 13 through table 21 provide ac specifications associated with the mobile pentium iii processor. the ac specifications are divided into the following categories: table 13 contains the system bus clock specifications; table 14 contains the processor core frequencies; table 15 contains the gtl+ specificati ons; table 16 contains the cmos and open - drain signal groups specifications; table 17 contains timings for the reset conditions; table 18 contains the apic specifications; table 19 contains the tap specifications; and table 20 and table 21 contain the power ma nagement timing specifications.
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz 245483 - 002 datasheet 21 all system bus ac specifications for the gtl+ signal group are relative to the rising edge of the bclk input at 1.25v. all gtl+ timings are referenced to v ref for both ?0? and ?1? logic levels unless otherwise specified. all apic, tap, cmos, and open - drain signals except pwrgood are referenced to 0.75v. table 13 . system bus clock ac specifications 1 t j = 0 c to 100 c; v cc = 1.10v 80 mv; v cc = 1.35v 100 mv or 1.60v 115 mv; v cct = 1.50v 115 mv symbol parameter min typ max unit figure notes system bus frequency 100 mhz t1 bclk period 10 ns figure 7 note 2 t2 bclk period stability 250 ps notes 3, 4 t3 bclk high time 2. 70 ns figure 7 at> 2.0 v t4 bclk low time 2. 45 ns figure 7 at<0. 5 v t5 bclk rise time 0.175 0.875 ns figure 7 (0.9v ? 1.6v) t6 bclk fall time 0.175 0.875 ns figure 7 (1.6v ? 0.9v) notes: 1. all ac timings for gtl+ and cmos sign als are referenced to the bclk rising edge at 1.25v. all cmos signals are referenced at 0.75v. 2. the bclk period allows a +0.5 - ns tolerance for clock driver variation. 3. not 100% tested. specified by design/characterization. 4. measured on the rising edge of adja cent bclks at 1.25v. the jitter present must be accounted for as a component of bclk skew between devices. table 14 . valid mobile pentium iii processor frequencies t j = 0 c to 100 c; v cc = 1.10v 80 mv; v cc = 1.35v 100 mv or 1.60v 115 mv; v cct = 1.50v 115 mv bclk frequency (mhz) frequency multiplier core frequency (mhz) power - on configuration bits [27, 25:22] 100 4 400 0, 0010 100 4.5 450 0, 0110 100 5 500 0, 0000 100 5.5 550 0, 0100 100 6 600 0, 1011 100 6.5 650 0, 1111 100 7 700 0, 1001 100 7.5 750 0, 1101 100 8 800 0, 1010 100 8.5 850 1, 0110 note: while other combinations of bus and core frequencies are defined, operation at frequencies other than those listed above will not be validated by intel and are not guaranteed. the frequency multiplier is programmed into the processor when it is manufactured and it cannot be changed.
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz datas heet 245483 - 002 22 table 15 . gtl+ signal groups ac specifications 1 r tt = 56w internally terminated to v cct ; v ref = 2 / 3 v cct ; load = 0 pf; t j = 0 c to 100 c; v cc = 1.10v 80 mv; v cc = 1.35v 100 mv or 1.60v 115 mv; v cct = 1.50v 115 mv symbol parameter min max unit figure notes t7 gtl+ output valid delay 0.2 2.7 ns figure 8 t 8 gtl+ input setup time 1.2 ns figure 9 notes 2, 3 t9 gtl+ input hold time 0.80 ns figure 9 note 4 t10 reset# pulse width 1 ms figure 10 , figure 11 note 5 notes: 1. all ac timings for gtl+ signals are referenced to the bclk rising edge at 1.25v. all gtl+ signals are referenced at v ref . 2. reset# can be asserted (active) asynchronously, but must be de - asserted synchronously. 3. specification is for a minimum 0.40v swing. 4. specification is for a maximum 1.0v swing. 5. after v cc , v cct , and bclk become stable and pwrgood is asserted. table 16 . cmos and open - drain signal groups ac sp ecifications 1, 2 t j = 0 c to 100 c; v cc = 1.10v 80 mv; v cc = 1.35v 100 mv or 1.60v 115 mv; v cct = 1.50v 115 mv symbol parameter min max unit figure notes t14 1.5v input pulse width, except pwrgood and lint[1:0] 2 bclks figure 8 active and inactive states t14b lint[1:0] input pulse width 6 bclks figure 8 note 3 t15 pwrgood inactive pulse width 10 bclks figure 11 notes 4, 5 notes: 1. all ac timings for cmos and open - drain signals are referenced to the bclk rising edge at 1.25v. all cmos and open - drain signals are referenced at 0.75v. 2. minimum output pulse width on cmos outputs is 2 bclks. 3. this specification only applies when the apic is enabled and the lint1 or lint0 signal is configured as an edge triggered interrupt with fixed delivery, otherwise specification t14 applies. 4. when driven inactive, or after v cc , v cct and bclk become stable. pwrgood must remain below v il25,max from table 12 until all the voltage planes meet the voltage tolerance specifications in table 9 and bclk has met the bclk ac specifications in table 13 for at least 10 clock cycles. pwrgood must rise glitch - free and monotonically to 2.5v. 5. if the bclk settl ing time specification (t60) can be guaranteed at power - on reset then the pwrgood inactive pulse width specification (t15) is waived and bclk may start after pwrgood is asserted. pwrgood must still remain below v il25,max until all the voltage planes meet t he voltage tolerance specifications.
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz 245483 - 002 datasheet 23 table 17 . reset configuration ac specifications t j = 0 c to 100 c; v cc = 1.10v 80 mv; v cc = 1.35v 100 mv or 1.60v 115 mv; v cct = 1.50v 115 mv symbol parameter min max unit figure notes t16 reset configuration signals (a[15:5]#, breq0#, flush#, init#, picd0) setup time 4 bclks figure 8. figure 9 before d eassertion of reset# t17 reset configuration signals (a[15:5]#, breq0#, flush#, init#, picd0) hold time 2 20 bclks figure 8. figure 9 after clock that deasserts reset# t18 reset#/pwrgood setup time 1 ms figure 11 before deassertion of reset# 1 note: at least 1 ms must pass after pwrgood rises above v ih25,min from table 12 and bclk meets its ac timing specification until reset# may be deasserted. table 18 . apic bus signal ac specifications 1 t j = 0 c to 100 c; v cc = 1.10v 80 mv; v cc = 1.35v 100 mv or 1.60v 115 mv; v cct = 1.50v 115 mv symbol parameter min max unit figure notes t21 picclk frequency 2 33.3 mhz note 2 t22 picclk period 30 500 ns figure 6 t23 picclk high time 10.5 ns figure 6 at>1.7v t24 picclk low time 10.5 ns figure 6 at<0.7v t25 picclk rise time 0.25 3.0 ns figure 6 (0.7v ? 1.7v) t26 picclk fall time 0.25 3.0 ns figure 6 (1.7v ? 0.7v) t27 picd[1:0] setup time 5 .0 ns figure 9 note 3 t28 picd[1:0] hold time 2.5 ns figure 9 note 3 t29 picd[1:0] valid delay (rising edge) picd[1:0] valid delay (falling edge) 1.5 1.5 8.7 12.0 ns ns figure 8 notes 3, 4, 5 notes: 1. all ac timings for apic signals are referenced to the picclk rising edge at 1.25v. all cmos signals are r eferenced at 0.75v. 2. the minimum frequency is 2 mhz when picd0 is at 1.5v at reset. if picd0 is strapped to v ss at reset then the minimum frequency is 0 mhz. 3. referenced to picclk rising edge. 4. for open - drain signals, valid delay is synonymous with float dela y. 5. valid delay timings for these signals are specified into 150 w to 1.5v and 0 pf of external load. for real system timings these specifications must be derated for external capacitance at 105 ps/pf.
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz datas heet 245483 - 002 24 table 19 . tap signal ac specifications 1 t j = 0 c to 100 c; v cc = 1.10v 80 mv; v cc = 1.35v 10 0 mv or 1.60v 115 mv; v cct = 1.50v 115 mv symbol parameter min max unit figure notes t30 tck frequency ? 16.67 m hz t31 tck period 60 ? ns figure 6 t32 tck high time 25.0 ns figure 6 3 1.2v, note 2 t33 tck low time 25.0 ns figure 6 0.6v, note 2 t34 tck rise time 5.0 ns figure 6 (0.6v ? 1.2v), notes 2, 3 t35 tck fall time 5.0 ns figure 6 (1.2v ? 1.6v), notes 2, 3 t36 trst# pulse width 40.0 ns figure 13 asynchronous, note 2 t37 tdi, tms setup time 5.0 ns figure 12 note 4 t38 tdi, tms hold time 14.0 ns figure 12 note 4 t39 tdo valid delay 1.0 10.0 ns figure 12 notes 5, 6 t40 tdo float delay 25.0 ns figure 12 notes 2, 5, 6 t41 all non - test outputs valid delay 2.0 25.0 ns figure 12 notes 5, 7, 8 t42 all non - test outputs float delay 25.0 ns figure 12 notes 2, 5, 7 , 8 t43 all non - test inputs setup time 5.0 ns figure 12 notes 4, 7, 8 t44 all non - test inputs hold time 13.0 ns figure 12 notes 4, 7, 8 notes: 1. all ac timings for tap signals are referenced to the tck rising edge at 0.75v. all tap and cmos signals are referenced at 0.75v. 2. not 100% tested. specified by design/characterization. 3. 1 ns can be added to the maximum tck rise and fall times for every 1 mhz below 16 mhz. 4. referenced to t ck rising edge. 5. referenced to tck falling edge. 6. valid delay timing for this signal is specified into 150 w terminated to 1.5v and 0 pf of external load. for real system timings these specifications must be derated for external capacitance at 105 ps/pf. 7. non - test outputs and inputs are the normal output or input signals (except tck, trst#, tdi, tdo, and tms). t hese timings correspond to the response of these signals due to boundary scan operations. 8. during debug port operation use the normal specified timings rather than the tap signal timings.
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz 245483 - 002 datasheet 25 table 20 . quick start/deep sleep ac specifica tions 1 t j = 0 c to 100 c; v cc = 1.10v 80 mv; v cc = 1.35v 100 mv or 1.60v 115 mv; v cct = 1.50v 115 mv symbol parameter min max unit figure notes t45 stop grant cycle complet ion to clock stop 100 bclks figure 14 t46 stop grant cycle completion to input signals stable 0 m s figure 14 t47 deep sleep pll lock latency 0 30 m s figure 14 , figure 15 note 2 t48 stpclk# hold time from pll lock 0 ns figure 14 t49 input signal hold time from stpclk# deassertion 8 bclks figure 14 notes: 1. input signals other than reset# and bpri# must be held constant in the quick start state. 2. the bclk settling time specification (t60) applies to deep sleep state exit under all conditions. table 21 . stop grant/sleep/deep sleep ac specifications t j = 0 c to 100 c; v cc = 1.10v 80 mv; v cc = 1.35v 100 mv or 1.60v 115 mv; v cct = 1.50v 115 mv symbol parameter min max unit figure t50 slp# signal hold time from stop grant cycle completion 100 bclks figure 15 t51 slp# assertion to input signals stable 0 n s figure 15 t52 slp# assertion to clock stop 10 bclks figure 15 t54 slp# hold time from pll lock 0 ns figure 15 t55 stpclk# h old time from slp# deassertion 10 bclks figure 15 t56 input signal hold time from slp# deassertion 10 bclks figure 15 note: input signals other than reset# must be held const ant in the sleep state. the bclk settling time specification (t60) applies to deep sleep state exit under all conditions. table 22 . intel speedstep technology ac specifications t j = 0 c to 100 c; v cc = 1.10v 80 mv; v cc = 1.35v 100 mv or 1.60v 115 mv; v cct = 1.50v 115 mv symbol parameter min max unit figure notes t57 ghi# setup time from bclk restart 150 ns figure 16 note 1 t58 ghi# hold time from bclk restart 30 m s figure 16 note 1 t59 ghi# sample delay 10 m s figure 16 note 1 t60 bclk settling time 150 ns figure 16 notes 2, 3 notes: 1. ghi# is ignored until 10 m s after bclk stops, the setup and hold window must occur after this time. 2. bclk must meet the bclk ac specification from table 13 within 150 ns of turning on (rising above v il,bclk ). 3. this specification applies to t he exit from the deep sleep state whether or not a intel speedstep technology operating mode transition occurs.
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz datas heet 245483 - 002 26 figure 6 through figure 16 are to be used in conjunction wit h table 13 through table 22 . figure 6 . picclk/tck clock timing waveform clk v h v l v trip t h t l t p t r t f d0003-01 notes : t r = t34, t25 (rise time) t f = t35, t26 (fall time) t h = t32, t23 (high time) t l = t33, t24 (low time) t p = t31, t22 (period) v trip = 1.25v for picclk; 0.75v for tck v l = 0.7v for picclk; 0.6v for tck v h = 2.0 v for picclk; 1.2v for tck figure 7 . bclk timin g waveform clk v h v trip t h t l t p t r d0003-02 v l t f 1.6v 0.9v notes : t r = t5 (rise time) t f = t6 (fall time) t h = t3 (high time) t l = t4 (low time) t p = t1 (period) v trip = 1.25v for bclk v l = 0. 5 v for bclk v h = 2.0 v for bclk
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz 245483 - 002 datasheet 27 figure 8 . valid delay timin gs clk signal t x t x t pw v valid valid d0004-00 notes : t x = t7, t11, t29 (valid delay) t pw = t14, t14b (pulse width) v = v ref for gtl+ signal group; 0.75v for cmos, open - drain, apic, and tap signal groups figure 9 . setup and hold timings clk signal v valid t h ts d0005-00 notes : t s = t 8, t12, t27 (setup time) t h = t9, t13, t28 (hold time) v = v ref for gtl+ signals; 0.75v for cmos, apic, and tap signals
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz datas heet 245483 - 002 28 figure 10 . cold/warm reset and configuration timings bclk reset# configuration (a[15:5], breq0#, flush#, init#, picd0) t v t x t t t u t w valid d0006-01 notes : t t = t9 (gtl+ input hold time) t u = t8 (gtl+ input setup time) t v = t10 (reset# pulse width) t18 (reset#/pwrgood setup time) t w = t16 (reset configuration signals (a[15:5]#, breq0#, flush#, i nit#, picd0) setup time) t x = t17 (reset configuration signals (a[15:5]#, breq0#, flush#, init#, picd0) hold time) figure 11 . power - on reset timings bclk pwrgood reset# t a t b v , cc v ref v , cct, v il25 ,max v ih25 ,min d0007-01 notes : t a = t15 (pwrgood inactive pulse width) t b = t10 (reset# pulse width)
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz 245483 - 002 datasheet 29 figure 12 . test timings (boundary scan) tck tdi, tms input signals tdo output signals 0.75v t v t w t r t s t x t u t y t z d0008-01 notes : t r = t43 (all non - test inputs setup time) t s = t44 (all non - test inputs hold time) t u = t40 (tdo float delay) t v = t37 (tdi, tms setup time) t w = t38 (tdi, tms hold time) t x = t39 (tdo valid delay) t y = t41 (all non - test outputs valid delay) t z = t42 (all non - test outputs float delay) figure 13 . test reset timings trst# 0.75v t q d0009-01 note : t q = t36 (trst# pulse width)
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz datas heet 245483 - 002 30 figure 14 . quick start/deep sleep timing t w stpgnt running running bclk stpclk# cpu bus slp# compatibility signals changing normal quick start deep sleep quick start normal frozen t v t y t z t x v0010-00 notes : t v = t45 (stop grant acknowledge bus cycle completion to clock shut off delay) t w = t46 (setup time to input signal hold requirement) t x = t47 (deep sleep pll lock latency) t y = t48 (pll lock to stpclk# hold time) t z = t49 (input signal hold time)
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz 245483 - 002 datasheet 31 figure 15 . stop grant/sleep/deep sleep timing t u stpgnt running bclk stpclk# cpu bus slp# compatibility signals frozen changing normal stop grant sleep deep sleep sleep stop grant normal running t t t v t y t z t w t x v0011-00 changing notes : t t = t50 (stop grant acknowledge bus cycle completion to slp# assertion delay) t u = t51 (setup time to input signal hold requirement) t v = t52 (slp# assertion to clock shut off delay) t w = t47 (deep sleep pll lock latency) t x = t54 (slp# hold time) t y = t55 (stpclk# hold time) t z = t56 (input signal hold time)
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz datas heet 245483 - 002 32 figure 16 . intel speedstep technology/deep sleep timing bclk v il25 bclk off bclk on (out of spec) bclk on (in spec) 1.25v 1.25v bclk on t s v0036-00 ghi# t h t y t x notes : t s = t57 (ghi# setup time from bclk restart) t h = t58 (ghi# hold time from bclk restart) t x = t59 (ghi# sample delay) t y = t60 (bclk settling time)
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz 245483 - 002 datasheet 33 4.0 system signal simulations many scenarios have been si mulated to generate a set of gtl+ processor system bus layout guidelines, which are available in the mobile coppermine processor gtl+ system bus layout guideline. systems must be simulated using the ibis model to determine if they are compliant with this s pecification. 4.1 system bus clock (bclk) and picclk ac signal quality specifications table 23 and figure 17 show the signal quality for the system bus clock (bclk) signal, an d table 24 and figure 17 show the signal quality for the apic bus clock (picclk) signal at the processor. bclk and picclk are 2.5v clocks. table 23 . bclk signal quality specifications symbol parameter min max unit figure notes v1 v il,bclk 0. 5 v figure 17 note 1 v2 v ih,bclk 2.0 v figure 17 note 1 v3 v in absolut e voltage range - 0.7 3.5 v figure 17 undershoot/overshoot, note 2 v4 bclk rising edge ringback 2.0 v figure 17 absolute value, note 3 v5 bclk falling edge ringback 0. 5 v figure 17 absolute value, note 3 notes: 1. the clock must rise/fall monotonically between v il,bclk and v ih,bclk . 2. these specifications apply only when bclk is running, see table 12 for the dc specifications for when bclk is stopped. bclk may n ot be above v ih,bclk,max or below v il, bclk,min for more than 50% of the clock cycle. 3. the rising and falling edge ringback voltage specified is the minimum (rising) or maximum (falling) absolute voltage the bclk signal can go to after passing the v ih,bclk ( rising) or v il,bclk (falling) voltage limits. table 24 . picclk signal quality specifications symbol parameter min max unit figure notes v1 v il25 0.7 v figure 17 note 1 v2 v ih25 2.0 v figure 17 note 1 v3 v in absolute voltage range - 0.7 3.5 v figure 17 undershoot/overshoot, note 2 v4 picclk rising edge ringback 2.0 v figure 17 absolute value, note 3 v5 picclk falling edge ringback 0. 7 v figure 17 absolute value, note 3 notes: 1. the clock must rise/fall monotonically between v il25 and v ih25 . 2. these specifications apply only wh en picclk is running, see table 12 for the dc specifications for when picclk is stopped. picclk may not be above v ih25,max or below v il25,min for more than 50% of the clock cycle. 3. the rising and falling edge ringba ck voltage specified is the minimum (rising) or maximum (falling) absolute voltage the picclk signal can go to after passing the v ih25 (rising) or v il25 (falling) voltage limits.
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz datas heet 245483 - 002 34 figure 17 . bclk/picclk generic clock waveform v0012-01 v1 v2 v3 max v4 v3 min v5 4.2 gtl+ ac signal quality specifications table 25 , figure 18 , and figure 19 illustrate the gtl+ signal quality specifications for the mobile pentium iii processor. refer to the pentium ? ii processor developer?s manual for the gtl+ buffer specification. the mobile pentium iii processor maximum overshoot and undershoot specifications for a given duration of time are specified in table 26 . contact your intel field sales representative for a copy of the overshoot_checker tool. the overshoot_checker determines if a specific waveform meets the overshoot/undershoot specification. figure 20 shows the overshoot/undershoot waveform. the tolerances listed in table 26 are conservative. signals that exceed these tolerances may still meet the processor over shoot/undershoot tolerance if the overshoot_checker tool says that they pass.
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz 245483 - 002 datasheet 35 table 25 . gtl+ signal group ringback specification symbol parameter min unit figure notes a overshoot 100 mv figure 18 , figure 19 notes 1, 2 t minimum time at high 0.5 ns figure 18 , figure 19 notes 1, 2 r amplitude of ringback - 200 mv figure 18 , figure 19 notes 1, 2, 3 f final settling voltage 200 mv figure 18 , figure 19 notes 1, 2 d duration of sequential ringback n/a ns figure 18 , figure 19 notes 1, 2 notes: 1. specified for the edge ra te of 0.3 ? 0.8 v/ns. see figure 18 for the generic waveform. 2. all values determined by design/characterization. 3. ringback below v ref,max + 200 mv is not authorized during low to high transitions. ringback above v re f,min ? 200 mv is not authorized during high to low transitions. figure 18 . low to high, gtl+ receiver ringback tolerance v ref,max +0.2v time t d r f a v ref,min -0.2v v ref,max v start clock v il,bclk v ih,bclk v0014-01
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz datas heet 245483 - 002 36 figure 19 . high to low, gtl+ receiver ringback tolerance v ref,max +0.2v time v ref,min -0.2v v ref,min v start clock v il,bclk v ih,bclk v0014-02 t d r f a table 26 . gtl+ signal group overshoot/undershoot tolerance at the processor core 1, 4, 5 overshoot amplitude 2 undershoot amplitude 3 allowed pulse duration 2.0v - 0.35v 0.35 ns 1.9v - 0.25v 1.2 ns 1.8v - 0.15v 4.3 ns notes: 1. under no circumstances should the g tl+ signal voltage ever exceed 2.0v maximum with respect to ground or - 2.0v minimum with respect to v cct (i.e., v cct - 2.0v) under operating conditions. 2. ringbacks below v cct cannot be subtracted from overshoots. lesser undershoot does not allocate longer o r larger overshoot. 3. ringbacks above ground cannot be subtracted from undershoots. lesser overshoot does not allocate longer or larger undershoot. 4. system designers are encouraged to follow intel provided gtl+ layout guidelines. 5. all values are specified by design characterization and are not tested.
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz 245483 - 002 datasheet 37 figure 20 . maximum acceptable overshoot/undershoot waveform v cct 2.0v max 1.9v 1.8v vss time dependant overshoot time dependant undershoot -.15v -.25v -.35v min a b c a b c note : the total overshoot/undershoot budget for one clock cycle is fully consumed by the a , b, or c waveforms. 4.3 non - gtl+ signal quality specifications signals driven to the mobile pentium iii processor should meet signal quality specifications to ensure that the processor reads data properly and that incoming signals do not affect the long - ter m reliability of the processor. unlike previous generations of mobile processors, the mobile pentium iii processor uses gtl+ buffers for non - gtl+ signals. the input and output paths of the buffers have been slowed down to match the requirements for the non - gtl+ signals. the signal quality specifications for the non - gtl+ signals are identical to the gtl+ signal quality specifications except that they are relative to v cmosref rather than v ref transitions overshoot_checker can be used to verify non - gtl+ signal compliance with the signal overshoot and undershoot tolerance. the tolerances listed in table 27 are conservative. signals that exceed these tolerances may still meet the processor overshoot and undershoot toleran ce if the overshoot_checker tool says that they pass.
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz datas heet 245483 - 002 38 table 27 . non - gtl+ signal group overshoot/undershoot tolerance at the processor core 1, 4, 5 overshoot amplitude 2 undershoot amplitude 3 allowed pulse duration 2.1v - 0.45v 0.4 5 ns 2.0v - 0.35v 1.5 ns 1.9v - 0.25v 5.0 ns 1.8v - 0.15v 17 ns notes: 1. under no circumstances should the non - gtl+ signal voltage ever exceed 2.1v maximum with respect to ground or - 2.1v minimum with respect to v cct (i.e., v cct - 2.1v) under operating conditions . 2. ring - backs below v cct cannot be subtracted from overshoots. lesser undershoot does not allocate longer or larger overshoot. 3. ring - backs above ground cannot be subtracted from undershoots. lesser overshoot does not allocate longer or larger undershoot. 4. sy stem designers are encouraged to follow intel provided non - gtl+ layout guidelines. 5. all values are specified by design characterization and are not tested. 4.3.1 pwrgood signal quality specifications the processor requires pwrgood to be a clean indication that cl ocks and the power supplies (v cc , v cct , etc.) are stable and within their specifications. clean implies that the signal will remain below v il25 and without errors from the time that the power supplies are turned on, until they come within specification. th e signal will then transition monotonically to a high (2.5v) state. pwrgood may not ringback below 2.0v after rising above v ih25 .
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz 245483 - 002 datasheet 39 5.0 mechanical specifications 5.1 surface - mount bga2 package dimensions the mobile pentium iii processor is packaged in a pbga - b495 pa ckage (also known as bga2) with the back of the processor die exposed on top. unlike previous mobile processors with exposed die, the back of the mobile pentium iii processor die may be polished and very smooth. the mechanical specifications for the surfac e - mount package are provided in tabl e 28 . figure 21 shows the top and side views of the surface - mount package, and figure 22 shows the bottom view of the surface - mount package. the substrate may only be contacted within the shaded region between the keep - out outline and the edge of the substrate. the mobile pentium iii processor will have one or two label marks. these label marks will be located alo ng the long edge of the substrate outside of the keep - out region and they will not encroach upon the 7 - mm by 7 - mm squares at the substrate corners. please note that in order to implement vid on the bga2 package, some vid[4:0] balls may be depopulated. tabl e 28 . surface - mount bga2 package specifications symbol parameter min max unit a overall height, as delivered 2.29 2.79 mm a 1 substrate height, as delivered 1.50 ref mm a 2 die height 0.854 ref mm b ball diameter 0.78 ref mm d pa ckage width 27.05 27.35 mm d 1 die width 8.81 ref (cpuid = 0686h) 9.28 ref (cpuid = 0683h) 9.37 ref (cpuid = 0681h) mm e package length 30.85 31.15 mm e ball pitch 1.27 mm e 1 die length 10.79 ref (cpuid = 0686h) 11.23 ref (cpuid = 0683h) 11.27 ref (cpui d = 0681h) mm n ball count 495 1 each s 1 outer ball center to short edge of substrate 0.895 ref mm s 2 outer ball center to long edge of substrate 0.900 ref mm p die allowable pressure on the die for thermal solution ? 689 kpa w package weight 4.5 ref gr ams note: exact ball count will vary depending on vid[4:0] encoding. see vid[4:0] signal description .
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz datas heet 245483 - 002 40 figure 21 . surface - mount bga2 package - top and side view 8.81 10.79 note: all dimensions are in millimeters. dimensions in figure are for r eference only, tabl e 28 for specifications.
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz 245483 - 002 datasheet 41 figure 22 . surface - mount bga2 package - bottom view note: all dimensions are in millimeters. the dimensions in the figure are for reference only. see tabl e 28 for specifications
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz datas heet 245483 - 002 42 5.2 socketable micro - pga2 package dimensions the mobile pentium iii processor is also packaged in a ppga - b495 package (also known as micro - pga2) wi th the back of the processor die exposed on top. unlike previous mobile processors with exposed die, the back of the mobile pentium iii processor die may be polished and very smooth. the mechanical specifications for the socketable package are provided in table 29 . figure 23 shows the top and side views of the socketable package, and figure 24 shows the bottom view of the socketable package. the substrate may only be contacted within the region between the keep - out outline and the edge of the substrate. the mobile pentium iii processor will have one or two label marks. these label marks will be located along the long edge of the subst rate outside of the keep - out region, and they will not encroach upon the 7 - mm by 7 - mm squares at the substrate corners. unlike the bga2 package, vid implementation does not require vid pins to be depopulated on the micro - pga2 package. table 29 . socketable micro - pga2 package specification symbol parameter min max unit a overall height, top of die to seating plane of interposer 3.13 3.73 mm a 1 pin length 1.25 ref mm a 2 die height 0.854 ref mm b pin diameter 0.30 ref mm d 2 package width 28.27 ref mm d die substrate width 27.05 27.35 mm d 1 die width 8.81 ref (cpuid = 0686h) 9.28 ref (cpuid = 0683h) 9.37 ref (cpuid = 0681h) mm e 2 package length 34.21 ref mm e die substrate length 30.85 31.15 mm e 1 die length 10.79 ref (cpuid = 0686h) 11.23 ref (cpuid = 0683h) 11.27 ref (cpuid = 0681h) mm e pin pitch 1.27 mm ? pin tip radial true position 0.127 ref mm n pin count 495 each s 1 outer pin center to short edge of substrate 2.144 ref mm s 2 outer pin center to long edge of substrate 1.206 ref mm p die allowable pressure on the die for thermal solution ? 689 kpa w package weight 6.2 ref grams
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz 245483 - 002 datasheet 43 figure 23 . socketable micro - pga2 package - top and side view 8.81 10.79 note: all dimensions are in millimeters. the dimensions in the figure are for reference only. see table 29 for specifications.
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz datas heet 245483 - 002 44 figure 24 . socketable micro - pga2 package - bottom view note: all dimensions are in millimeters. the dimensions in the figure are for reference only. see table 29 for specifications. 5.3 signal listings figure 25 is a top - side view of the ball or pin map of the mobile pentium iii processor with the voltage balls/pins called out. table 30 lists the signals in ball/pin number order. table 31 lists the signals in signal name order.
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz 245483 - 002 datasheet 45 figure 25 . pin/ball map - top view v0024-03 vcc other vcct vss analog decoupling vss d30# d21# d23# nc nc nc d10# d14# vss vss nc d5# vss vss reset# a33# a32# a29# vss d31# d29# d27# vss d22# d13# vss d18# d9# d11# d7# vss d4# vss vss vss vss a34# a28# a30# vss d33# d35# vss d26# d24# vss vss nc d20# d8# vss d6# vss d3# d2# breq0# a35# a20# a26# a31# a27# d38# d37# d32# d28# d25# nc d16# nc d15# d17# d1# d0# vss nc vss vss a24# a25# a21# vss a22# d45# d43# vss d34# vref vref nc d19# vss d12# vss vss vss vss vss berr# vref a15# vss a23# a19# d42# vss vref a17# vss a18# a16# d51# d49# nc testp vss nc a13# d47# vss nc testp nc vss a14# d59# d46# nc vss a11# a5# a10# d53# vss a8# a12# a4# vss a9# d55# d60# vss a6# a3# a7# d56# vss nc nc bclk defer# vss vss testlo2 vss vss vss vss dep5# dep6# vss nc nc clkref dep3# vss vss vss vss ghi# lock# dep1# d58# vss bnr# vss req0# drdy# dep2# vss vref bpri# defer# trdy# rs0# binit# dep0# pwrgood req1# vss req2# hit# bpm0# prdy# req4# vss req3# rp# rs2# bp3# picd1 testlo1 hitm# vss ap1# rsp# bp2# vss nc vss dbsy# rs1# aerr# picd0 preq# vss vss ads# ap0# vss nc vss nc vss vss testp vid2 vid0 vss vss 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 pll2 vss vss nc vcct vcct vcct vcct vcct vcct vcct vcct vcct vcct vcct vcct d44# d39# vcct vcct vss d48# vcct vcct d61# d54# vcct vcct vss vss vcct vcct vss d50# vcct vcct d56# d63# vcct vcct vss vss vcct vcct dep7# d62# vcct vcct vss dep4# vcct vcct vcct vcct vcct vcct vcct vcct vcct vcct vcct vcct bpm1# vss vcct vcct vcct vcct vcct vcct vcct vcct vcct vcct vcct vcct vss vref vref vss vss vss vss vss vss vss vss vcct vcct vcct vss d41# vcct vcct d57# d52# vcct vcct d36# d40# vref vss vss vss vss vss vss vss vss vss vss vss nc picclk testp edge ctrlp therm da trst# vss bsel0 tck init# cmos ref vcct vcct vcct rsvd intr vss therm dc bsel1 vss vss slp# vss smi# vss vcct vcct vcct nmi vss nc vss tdo vss ignne# ferr# stpclk# vss flush# vcct vcct vcct rtt impedp cmos ref testhi vss nc tms tdi nc nc a20m# ierr# vcct vcct vcct a b c d e f g h j k l m n p r t u v w y aa ab ac ad vss vcc vss vcc vss vcc vcc vss vcc vss vcc vss vss vcc vss vcc vss vcc vss vcc vss vcc vss vcc vss vcc vss vcc vcc vss vcc vss vcc vss vss vcc vss vcc vss vcc vcc vss vcc vss vcc vss vcc vss vcc vss vcc vss vss vcc vss vcc vss vcc vcc vss vss vcc vcc vss vss vcc vcc vss vss vcc vcc vss vss vcc vcc vss vcc vss vss vcc vss vcc vcc vss vss vcc vcc vss vss vcc vcc vss vss vcc vcc vss vcc vss vss vcc vid4 vid3 vid1 pll1 vcct 2 notes: 1. in order to implement v id on the bga2 package, some vid[4:0] balls may be depopulated. however, on the micro - pga2 package, vid[4:0] pins are not depopulated. 2. for the low - voltage processor with a core operating voltage at 1.1v, pin/ball ?p1? must be connected to v cc . for other pr ocessors, this pin/ball can be connected to either v cct or v cc .
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz datas heet 245483 - 002 46 table 30 . signal listing in order by pin/ball number no. signal name no. signal name no. signal name no. signal name a2 vss c3 a26# e2 a23# g1 a13# a3 a29# c4 a20# e 3 vss g2 nc a4 a32# c5 a35# e4 a15# g3 vss a5 a33# c6 breq0# e5 vref g4 testp a6 reset# c7 d2# e6 berr# g5 nc a7 vss c8 d3# e7 vss g6 vcct a8 vss c9 vss e8 vss g7 vcct a9 d5# c10 d6# e9 vss g8 vcct a12 vss c11 vss e10 vss g9 vcct a13 d14# c12 d8# e 11 vss g10 vcct a14 d10# c13 d20# e12 d12# g11 vcct a15 nc c14 nc e13 vss g12 vcct a16 nc c15 vss e14 d19# g13 vcct a17 nc c16 vss e15 nc g14 vcct a18 d23# c17 d24# e16 vref g15 vcct a19 d21# c18 d26# e17 vref g16 vcct a20 d30# c19 vss e18 d34# g17 vcct a21 vss c20 d35# e19 vss g18 nc b1 vss c21 d33# e20 d43# g19 vss b2 a30# d1 a22# e21 d45# g20 d49# b3 a28# d2 vss f1 a16# g21 d51# b4 a34# d3 a21# f2 a18# h1 a14# b5 vss d4 a25# f3 vss h2 vss b6 vss d5 a24# f4 a17# h3 nc b7 vss d6 vss f5 vref h4 testp b8 vss d7 vss f6 vss h5 nc b9 d4# d8 nc f7 vss h6 vcct b10 vss d9 vss f8 vss h7 vss b11 d7# d10 d0# f9 vss h8 vcc b12 d11# d11 d1# f10 vss h9 vss b13 d9# d12 d17# f11 vss h10 vcc b14 d18# d13 d15# f12 vss h11 vss b15 vss d14 nc f13 vss h12 vcc b16 d13# d15 d16# f14 vss h13 vss b17 d22# d16 nc f15 vss h14 vcc b18 vss d17 d25# f16 vss h15 vss b19 d27# d18 d28# f17 vref h16 vcc b20 d29# d19 d32# f18 d40# h17 vcct b21 d31# d20 d37# f19 d36# h18 d39# c1 a27# d21 d38# f20 vss h19 d44# c2 a31# e1 a19# f21 d42# h20 vss
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz 245483 - 002 datasheet 47 no. signal name no. signal name no. signal name no. signal name h21 d47# k20 vss m20 vss r1 lock# j1 a10# k21 d53# n2 vss r2 ghi# j2 a5# l1 a7# n3 vss r3 vss j3 a11# l2 pll1 n4 vss r4 vss j4 vss l3 a3# n5 testlo2 r5 vss j5 nc l4 a6# n6 vcct r6 vcct j6 vcct l5 vss n7 vcc r7 vcc j7 vcc l6 vcct n8 vss r8 vss j8 vss l7 vcc n9 vcc r9 vcc j9 vcc l8 vss n10 vss r10 vss j10 vss l9 vcc n11 vcc r11 vcc j11 vcc l10 vss n12 vss r12 vss j12 vss l11 vcc n13 vcc r13 vcc j13 vc c l12 vss n14 vss r14 vss j14 vss l13 vcc n15 vcc r15 vcc j15 vcc l14 vss n16 vss r16 vss j16 vss l15 vcc n17 vcct r17 vcct j17 vcct l16 vss n18 vss r18 d63# j18 d41# l17 vcct n19 vss r19 d56# j19 vss l18 d48# n20 vss r20 vss j20 d46# l19 vss p1* vc ct r21 dep3# j21 d59# l20 d60# p2 clkref t1 drdy# k1 a9# l21 d55# p3 nc t2 req0# k2 vss m2 pll2 p4 nc t3 vss k3 a4# m3 bclk p5 vss t4 bnr# k4 a12# m4 nc p6 vcct t5 vss k5 a8# m5 nc p7 vss t6 vcct k6 vcct m6 vcct p8 vcc t7 vss k7 vss m7 vss p9 vss t 8 vcc k8 vcc m8 vcc p10 vcc t9 vss k9 vss m9 vss p11 vss t10 vcc k10 vcc m10 vcc p12 vcc t11 vss k11 vss m11 vss p13 vss t12 vcc k12 vcc m12 vcc p14 vcc t13 vss k13 vss m13 vss p15 vss t14 vcc k14 vcc m14 vcc p16 vcc t15 vss k15 vss m15 vss p17 vcc t t16 vcc k16 vcc m16 vcc p18 d50# t17 vcct k17 vcct m17 vcct p19 vss t18 vss k18 d52# m18 d54# p20 dep6# t19 vss k19 d57# m19 d61# p21 dep5# t20 d58#
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz datas heet 245483 - 002 48 no. signal name no. signal name no. signal name no. signal name t21 dep1# v20 dep0# y19 vss ab18 i ntr/lint0 u1 rs0# v21 binit# y20 picd1 ab19 rsvd u2 trdy# w1 rs2# y21 bp3# ab20 preq# u3 defer# w2 rp# aa1 aerr# ab21 picd0 u4 bpri# w3 req3# aa2 rs1# ac1 vss u5 vref w4 vss aa3 dbsy# ac2 vss u6 vcct w5 req4# aa4 vss ac3 nc u7 vcc w6 vcct aa5 nc ac4 vid3 u8 vss w7 vcct aa6 vcct ac5 vss u9 vcc w8 vcct aa7 vcct ac6 vcct u10 vss w9 vcct aa8 vcct ac7 vcct u11 vcc w10 vcct aa9 cmosref ac8 vcct u12 vss w11 vcct aa10 init# ac9 flush# u13 vcc w12 vcct aa11 tck ac10 vss u14 vss w13 vcct aa12 bsel0 ac11 stpclk# u15 vcc w14 vcct aa13 vss ac12 ferr# u16 vss w15 vcct aa14 trst# ac13 ignne# u17 vcct w16 vcct aa15 thermda ac14 vss u18 d62# w17 vcct aa16 edgectrlp ac15 tdo u19 dep7# w18 vss aa17 testp ac16 vss u20 vss w19 bpm1# aa18 picclk ac17 nc u21 d ep2# w20 prdy# aa19 nc ac18 vss v1 hit# w21 bpm0# aa20 vss ac19 nmi/lint1 v2 req2# y1 rsp# aa21 bp2# ac20 nc v3 vss y2 ap1# ab1 ap0# ac21 vss v4 req1# y3 vss ab2 ads# ad1 vss v5 pwrgood y4 hitm# ab3 vss ad2 vid0 v6 vcct y5 testlo1 ab4 vid4 ad3 vid1 v7 vcct y6 vcct ab5 vss ad4 vid2 v8 vcct y7 vcct ab6 vcct ad5 vss v9 vcct y8 vcct ab7 vcct ad6 vcct v10 vcct y9 vss ab8 vcct ad7 vcct v11 vcct y10 vss ab9 vss ad8 vcct v12 vcct y11 vss ab10 smi# ad9 ierr# v13 vcct y12 vss ab11 vss ad10 a20m# v14 vcc t y13 vss ab12 slp# ad13 tdi v15 vcct y14 vss ab13 vss ad14 tms v16 vcct y15 vss ab14 vss ad15 nc v17 vcct y16 vss ab15 bsel1 ad16 vss v18 dep4# y17 vref ab16 thermdc ad17 testhi v19 vss y18 vref ab17 vss ad18 cmosref
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz 245483 - 002 datasheet 49 no. signal name no. signal name no. signal name no. signal name ad19 rttimpedp ad20 testp ad21 vss note: for the low - voltage processor with a core operating voltage at 1.1v, pin/ball ?p1? is required to be connected to v cc . for other processors this pin/ball can be connected to either v cc t or v cc .
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz datas heet 245483 - 002 50 table 31 . signal listing in order by signal name no. signal name signal buffer type no. signal name signal buffer type l3 a3# gtl+ i/o t4 bnr# gtl+ i/o k3 a4# gtl+ i/o aa21 bp2# gtl+ i/o j2 a5# gtl+ i/o y21 bp3# gtl+ i /o l4 a6# gtl+ i/o w21 bpm0# gtl+ i/o l1 a7# gtl+ i/o w19 bpm1# gtl+ i/o k5 a8# gtl+ i/o u4 bpri# gtl+ input k1 a9# gtl+ i/o c6 breq0# gtl+ i/o j1 a10# gtl+ i/o aa12 bsel0 3.3 v cmos input j3 a11# gtl+ i/o ab15 bsel1 3.3 v cmos input k4 a12# gtl + i/o p2 clkref bclk reference voltage g1 a13# gtl+ i/o aa9 cmosref cmos reference voltage h1 a14# gtl+ i/o ad18 cmosref cmos reference voltage e4 a15# gtl+ i/o d10 d0# gtl+ i/o f1 a16# gtl+ i/o d11 d1# gtl+ i/o f4 a17# gtl+ i/o c7 d2# gtl+ i/o f2 a1 8# gtl+ i/o c8 d3# gtl+ i/o e1 a19# gtl+ i/o b9 d4# gtl+ i/o c4 a20# gtl+ i/o a9 d5# gtl+ i/o d3 a21# gtl+ i/o c10 d6# gtl+ i/o d1 a22# gtl+ i/o b11 d7# gtl+ i/o e2 a23# gtl+ i/o c12 d8# gtl+ i/o d5 a24# gtl+ i/o b13 d9# gtl+ i/o d4 a25# gtl+ i/o a1 4 d10# gtl+ i/o c3 a26# gtl+ i/o b12 d11# gtl+ i/o c1 a27# gtl+ i/o e12 d12# gtl+ i/o b3 a28# gtl+ i/o b16 d13# gtl+ i/o a3 a29# gtl+ i/o a13 d14# gtl+ i/o b2 a30# gtl+ i/o d13 d15# gtl+ i/o c2 a31# gtl+ i/o d15 d16# gtl+ i/o a4 a32# gtl+ i/o d12 d1 7# gtl+ i/o a5 a33# gtl+ i/o b14 d18# gtl+ i/o b4 a34# gtl+ i/o e14 d19# gtl+ i/o c5 a35# gtl+ i/o c13 d20# gtl+ i/o ad10 a20m# 1.5v cmos input a19 d21# gtl+ i/o ab2 ads# gtl+ i/o b17 d22# gtl+ i/o aa1 aerr# gtl+ i/o a18 d23# gtl+ i/o ab1 ap0# gtl+ i/o c17 d24# gtl+ i/o y2 ap1# gtl+ i/o d17 d25# gtl+ i/o m3 bclk 2.5v clock input c18 d26# gtl+ i/o e6 berr# gtl+ i/o b19 d27# gtl+ i/o v21 binit# gtl+ i/o d18 d28# gtl+ i/o
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz 245483 - 002 datasheet 51 no. signal name signal buffer type no. signal name signal buffer type b20 d 29# gtl+ i/o v18 dep4# gtl+ i/o a20 d30# gtl+ i/o p21 dep5# gtl+ i/o b21 d31# gtl+ i/o p20 dep6# gtl+ i/o d19 d32# gtl+ i/o u19 dep7# gtl+ i/o c21 d33# gtl+ i/o t1 drdy# gtl+ i/o e18 d34# gtl+ i/o aa16 edgectrlp gtl+ control c20 d35# gtl+ i/o ac12 fe rr# 1.5v open drain output f19 d36# gtl+ i/o ac9 flush# 1.5v cmos input d20 d37# gtl+ i/o v1 hit# gtl+ i/o d21 d38# gtl+ i/o y4 hitm# gtl+ i/o h18 d39# gtl+ i/o ad9 ierr# 1.5v open drain output f18 d40# gtl+ i/o ac13 ignne# 1.5v cmos input j18 d41# g tl+ i/o aa10 init# 1.5v cmos input f21 d42# gtl+ i/o ab18 intr/lint0 1.5v cmos input e20 d43# gtl+ i/o r1 lock# gtl+ i/o h19 d44# gtl+ i/o ac19 nmi/lint1 1.5v cmos input e21 d45# gtl+ i/o aa18 picclk 2.5v apic clock input j20 d46# gtl+ i/o ab21 picd0 1.5v open drain i/o h21 d47# gtl+ i/o y20 picd1 1.5v open drain i/o l18 d48# gtl+ i/o l2 pll1 pll analog voltage g20 d49# gtl+ i/o m2 pll2 pll analog voltage p18 d50# gtl+ i/o w20 prdy# gtl+ output g21 d51# gtl+ i/o ab20 preq# 1.5v cmos input k18 d52 # gtl+ i/o v5 pwrgood 2.5v cmos input k21 d53# gtl+ i/o t2 req0# gtl+ i/o m18 d54# gtl+ i/o v4 req1# gtl+ i/o l21 d55# gtl+ i/o v2 req2# gtl+ i/o r19 d56# gtl+ i/o w3 req3# gtl+ i/o k19 d57# gtl+ i/o w5 req4# gtl+ i/o t20 d58# gtl+ i/o u1 rs0# gtl+ i nput j21 d59# gtl+ i/o a6 reset# gtl+ input l20 d60# gtl+ i/o w2 rp# gtl+ i/o m19 d61# gtl+ i/o aa2 rs1# gtl+ input u18 d62# gtl+ i/o w1 rs2# gtl+ input r18 d63# gtl+ i/o y1 rsp# gtl+ input aa3 dbsy# gtl+ i/o r2 ghi# reserved u3 defer# gtl+ input ab 19 rsvd reserved v20 dep0# gtl+ i/o ad19 rttimpedp gtl+ pull - up control t21 dep1# gtl+ i/o ab12 slp# 1.5v cmos input u21 dep2# gtl+ i/o ab10 smi# 1.5v cmos input r21 dep3# gtl+ i/o ac11 stpclk# 1.5v cmos input
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz datas heet 245483 - 002 52 no. signal name signal buffer type no. s ignal name signal buffer type aa11 tck 1.5v jtag clock input aa14 trst# jtag input ad13 tdi jtag input ad2 vid0 voltage identification ac15 tdo jtag output ad3 vid1 voltage identification ad17 testhi test input ad4 vid2 voltage identification y5 testl o1 test input ac4 vid3 voltage identification n5 testlo2 test input ab4 vid4 voltage identification ad20 testp core voltage test point e5 vref gtl+ reference voltage h4 testp core voltage test point e16 vref gtl+ reference voltage aa17 testp core volta ge test point e17 vref gtl+ reference voltage g4 testp core voltage test point f5 vref gtl+ reference voltage aa15 thermda thermal diode anode f17 vref gtl+ reference voltage ab16 thermdc thermal diode cathode u5 vref gtl+ reference voltage ad14 tms jt ag input y17 vref gtl+ reference voltage u2 trdy# gtl+ input y18 vref gtl+ reference voltage table 32 . voltage and no - connect pin/ball locations signal name pin/ball numbers nc a15, a16, a17, c14, d8, d14, d16, e15, g2, g5, g18, h3, h5, j5, m4, m5, p3, p4, aa5, aa19, ac3, ac17, ac20, ad15 vcc h8, h10, h12, h14, h16, j7, j9, j11, j13, j15, k8, k10, k12, k14, k16, l7, l9, l11, l13, l15, m8, m10, m12, m14, m16, n7, n9, n11, n13, n15, p1*, p8, p10, p12, p14, p16, r7, r9, r11, r13, r 15, t8, t10, t12, t14, t16, u7, u9, u11, u13, u15 vcct g6, g7, g8, g9, g10, g11, g12, g13, g14, g15, g16, g17, h6, h17, j6, j17, k6, k17, l6, l17, m6, m17, n6, n17, p1*, p6, p17, r6, r17, t6, t17, u6, u17, v6, v7, v8, v9, v10, v11, v12, v13, v14, v15, v16 , v17, w6, w7, w8, w9, w10, w11, w12, w13, w14, w15, w16, w17, y6, y7, y8, aa6, aa7, aa8, ab6, ab7, ab8, ac6, ac7, ac8, ad6, ad7, ad8 vss a2, a7, a8, a12, a21, b1, b5, b6, b7, b8, b10, b15, b18, c9, c11, c15, c16, c19, d2, d6, d7, d9, e3, e7, e8, e9, e10, e11, e13, e19, f3, f6, f7, f8, f9, f10, f11, f12, f13, f14, f15, f16, f20, g3, g19, h2, h7, h9, h11, h13, h15, h20, j4, j8, j10, j12, j14, j16, j19, k2, k7, k9, k11, k13, k15, k20, l5, l8, l10, l12, l14, l16, l19, m7, m9, m11, m13, m15, m20, n2, n3, n4, n 8, n10, n12, n14, n16, n18, n19, n20, p5, p7, p9, p11, p13, p15, p19, r3, r4, r5, r8, r10, r12, r14, r16, r20, t3, t5, t7, t9, t11, t13, t15, t18, t19, u8, u10, u12, u14, u16, u20, v3, v19, w4, w18, y3, y9, y10, y11, y12, y13, y14, y15, y16, y19, aa4, aa13 , aa20, ab3, ab5, ab9, ab11, ab13, ab14, ab17, ac1, ac2, ac5, ac10, ac14, ac16, ac18, ac21, ad1, ad5, ad16, ad21 note: for the low voltage processor with a core operating voltage at 1.1v, pin/ball ?p1? is required to be connected to vcc. for other processors th is pin/ball can be connected to either vcct or vcc.
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz 245483 - 002 datasheet 53 6.0 thermal specifications this chapter provides needed data for designing a thermal solution. the mobile pentium iii processor is either a surface - mount pbga - b495 package or a socketable ppga - b495 package wi th the back of the processor die exposed and has a specified operational junction temperature (t j ) limit. in order to achieve proper cooling of the processor, a thermal solution (e.g., heat spreader, heat pipe, or other heat transfer system) must make firm contact to the exposed processor die. the processor die must be clean before the thermal solution is attached or the processor may be damaged. table 33 provides the maximum thermal design power (tdp max ) dissipati on and the minimum and maximum t j temperatures for the mobile pentium iii processor. a thermal solution should be designed to ensure the junction temperature never exceeds these specifications. if no closed loop thermal failsafe mechanism (processor thro ttling) is present to maintain t j within specification then the thermal solution should be designed to cool the tdp max condition. if a thermal failsafe mechanism is present then thermal solution could possibly be designed to a typical thermal design power (tdp typ ). tdp typ is a thermal design power recommendation based on the power dissipation of the processor while executing publicly available software under normal operating conditions at nominal voltages. tdp typ power is lower than tdp max . contact your intel field sales representative for further information.
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz datas heet 245483 - 002 54 table 33 . power specifications for mobile pentium iii processor with intel speedstep technology symbol parameter min typ 1 max unit notes tdp thermal design power at 500 m hz &1.10v at 55 0 mhz & 1. 35 v at 6 0 0 mhz & 1. 35 v at 700 mhz & 1.60v at 750 mhz & 1.60v ? ? ? ? 8.1 13.2 14.4 23.0 24.6 w w w w w at 100c, notes 2, 3 p sgnt stop grant and auto halt power at 1.10v at 1.35v at 1.60v ? ? ? 0.8 1.1 1.7 w w w at 50c, note 3 p qs quick start and sleep power at 1.10v at 1.35v at 1.60v ? ? ? 0.6 0.8 1.3 w w w at 50c, note 3 p dslp deep sleep power at 1.10v at 1. 35v at 1.60v ? ? ? 0.2 0.3 0.5 w w w at 35c, note 3 t j junction temperature 0 100 c note 4 notes: 1. tdp typ is a recommendation based on the power dissipation of the processor while executing publicly available software under normal operating conditions a t nominal voltages. contact your intel field sales representative for further information. 2. tdp max is a specification of the total power dissipation of the processor while executing a worst - case instruction mix under normal operating conditions at nominal v oltages. it includes the power dissipated by all of the components within the processor. not 100% tested. specified by design/characterization. 3. not 100% tested or guaranteed. the power specifications are composed of the current of the processor on the vari ous voltage planes. these currents are measured and specified at high temperature in table 9 . these power specifications are determined by characterization of the processor currents at higher temperatures. 4. t j is me asured with the on - die thermal diode. 6.1 thermal diode the mobile pentium iii processor has an on - die thermal diode that can be used to monitor the die temperature (t j ). a thermal sensor located on the motherboard, or a stand - alone measurement kit, may moni tor the die temperature of the processor for thermal management or instrumentation purposes. table 34 and table 35 provide the diode interface and specifications. note: th e reading of the thermal sensor connected to the thermal diode will not necessarily reflect the temperature of the hottest location on the die. this is due to inaccuracies in the thermal sensor, on - die temperature gradients between the location of the ther mal diode and the hottest location on the die, and time based variations in the die temperature measurement. time based variations can occur when the sampling rate of the thermal diode (by the thermal sensor) is slower than the rate at which the t j temper ature can change. refer to the intel? mobile pentium? iii processor thermal specification guideline for more details.
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz 245483 - 002 datasheet 55 table 34 . thermal diode interface signal name pin/ball number signal description thermda aa15 thermal diode ano de thermdc ab16 thermal diode cathode table 35 . thermal diode specifications symbol parameter min typ max unit notes i fw forward bias current 5 500 m a note 1 n diode ideality factor 1.0057 1.0080 1.0125 notes 2, 3, 4 notes: 1. intel d oes not support or recommend operation of the thermal diode under reverse bias. intel does not support or recommend operation of the thermal diode when the processor power supplies are not within their specified tolerance range. 2. characterized at 100c. 3. not 100% tested. specified by design/characterization. 4. the ideality factor, n, represents the deviation from ideal diode behavior as exemplified by the diode equation: where i s = saturation current, q = electronic charge, v d = voltage across the diode, k = bo ltzmann constant, and t = absolute temperature (kelvin). ? ? ? ? - = 1 q s fw nkt v d e i i
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz datas heet 245483 - 002 56 7.0 processor initialization and configuration 7.1 description the mobile pentium iii processor has some configuration options that are determined by hardware and some that are dete rmined by software. the processor samples its hardware configuration at reset on the active - to - inactive transition of reset#. most of the configuration options for the mobile pentium iii processor are identical to those of the pentium ii processor. the pen tium ? ii processor developer?s manual describes these configuration options. new configuration options for the mobile pentium iii processor are described in the remainder of this section. 7.1.1 quick start enable the processor normally enters the stop grant stat e when the stpclk# signal is asserted but it will enter the quick start state instead if a15# is sampled active on the reset# signal?s active - to - inactive transition. the quick start state supports snoops from the bus priority device like the stop grant sta te but it does not support symmetric master snoops nor is the latching of interrupts supported. a ?1? in bit position 5 of the power - on configuration register indicates that the quick start state has been enabled. 7.1.2 system bus frequency the current generatio n mobile pentium iii processor will only function with a system bus frequency of 100 mhz. bit positions 18 to 19 of the power - on configuration register indicates at which speed a processor will run. a ?00? in bits [19:18] indicates a 66 - mhz bus frequency, a ?10? indicates a 100 - mhz bus frequency, and a ?01? indicates a 133 - mhz bus frequency. 7.1.3 apic enable if the picd0 signal is sampled low on the active - to - inactive transition of the reset# signal then the picclk signal can be tied to v ss . otherwise the picd[ 1:0] signals must be pulled up to v cct and picclk must be supplied. driving picd0 low at reset also has the effect of clearing the apic global enable bit in the apic base msr. this bit is normally set when the processor is reset, but when it is cleared the apic is completely disabled until the next reset. 7.2 clock frequencies and ratios the mobile pentium iii processor uses a clock design in which the bus clock is multiplied by a ratio to produce the processor?s internal (or ?core?) clock. unlike some of the m obile pentium ii processors, the ratio used is programmed into the processor during manufacturing. the bus ratio programmed into the processor is visible in bit positions 22 to 25 and bit 27 of the power - on configuration register. table 14 shows the 5 - bit codes in the power - on configuration register and their corresponding bus ratios.
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz 245483 - 002 datasheet 57 8.0 processor interface 8.1 alphabetical signal reference a[35:3]# (i/o - gtl+) the a[35:3]# (address) signals define a 2 36 - byte physical mem ory address space. when ads# is active, these signals transmit the address of a transaction; when ads# is inactive, these signals transmit transaction information. these signals must be connected to the appropriate pins/balls of both agents on the system b us. the a[35:24]# signals are protected with the ap1# parity signal, and the a[23:3]# signals are protected with the ap0# parity signal. on the active - to - inactive transition of reset#, each processor bus agent samples a[35:3]# signals to determine its powe r - on configuration. see section 4 .0 of this document and the pentium ? ii processor developer?s manual for details. a20m# (i - 1.5v tolerant) if the a20m# (address - 20 mask) input signal is asserted, the processor mas ks physical address bit 20 (a20#) before looking up a line in any internal cache and before driving a read/write transaction on the bus. asserting a20m# emulates the 8086 processor's address wrap - around at the 1 - mbyte boundary. assertion of a20m# is only s upported in real mode. ads# (i/o - gtl+) the ads# (address strobe) signal is asserted to indicate the validity of a transaction address on the a[35:3]# signals. both bus agents observe the ads# activation to begin parity checking, protocol checking, addre ss decode, internal snoop or deferred reply id match operations associated with the new transaction. this signal must be connected to the appropriate pins/balls on both agents on the system bus. aerr# (i/o - gtl+) the aerr# (address parity error) signal is observed and driven by both system bus agents, and if used, must be connected to the appropriate pins/balls of both agents on the system bus. aerr# observation is optionally enabled during power - on configuration; if enabled, a valid assertion of aerr# abo rts the current transaction. if aerr# observation is disabled during power - on configuration, a central agent may handle an assertion of aerr# as appropriate to the error handling architecture of the system. ap[1:0]# (i/o - gtl+) the ap[1:0]# (address pari ty) signals are driven by the request initiator along with ads#, a[35:3]#, req[4:0]# and rp#. ap1# covers a[35:24]#. ap0# covers a[23:3]#. a correct parity signal is high if an even number of covered signals is low and low if an odd number of covered
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz datas heet 245483 - 002 58 signa ls are low. this allows parity to be high when all the covered signals are high. ap[1:0]# should be connected to the appropriate pins/balls on both agents on the system bus. bclk (i - 2.5v tolerant) the bclk (bus clock) signal determines the system bus fre quency. both system bus agents must receive this signal to drive their outputs and latch their inputs on the bclk rising edge. all external timing parameters are specified with respect to the bclk signal. berr# (i/o - gtl+) the berr# (bus error) signal is asserted to indicate an unrecoverable error without a bus protocol violation. it may be driven by either system bus agent and must be connected to the appropriate pins/balls of both agents, if used. however, the mobile pentium iii processors do not observ e assertions of the berr# signal. berr# assertion conditions are defined by the system configuration. configuration options enable the berr# driver as follows: enabled or disabled asserted optionally for internal errors along with ierr# asserted optionally by the request initiator of a bus transaction after it observes an error asserted by any bus agent when it observes an error in a bus transaction binit# (i/o - gtl+) the binit# (bus initialization) signal may be observed and driven by both system bus agen ts and must be connected to the appropriate pins/balls of both agents, if used. if the binit# driver is enabled during the power - on configuration, binit# is asserted to signal any bus condition that prevents reliable future information. if binit# is enabl ed during power - on configuration, and binit# is sampled asserted, all bus state machines are reset and any data which was in transit is lost. all agents reset their rotating id for bus arbitration to the state after reset, and internal count information is lost. the l1 and l2 caches are not affected. if binit# is disabled during power - on configuration, a central agent may handle an assertion of binit# as appropriate to the machine check architecture (mca) of the system. bnr# (i/o - gtl+) the bnr# (block nex t request) signal is used to assert a bus stall by any bus agent that is unable to accept new bus transactions. during a bus stall, the current bus owner cannot issue any new transactions. since multiple agents may need to request a bus stall simultaneousl y, bnr# is a wired - or signal that must be connected to the appropriate pins/balls of both agents on the system bus. in order to avoid wire - or glitches associated with simultaneous edge transitions driven by multiple drivers, bnr# is activated on specific c lock edges and sampled on specific clock edges.
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz 245483 - 002 datasheet 59 bp[3:2]# (i/o - gtl+) the bp[3:2]# (breakpoint) signals are the system support group breakpoint signals. they are outputs from the processor that indicate the status of breakpoints. bpm[1:0]# (i/o - gtl+) th e bpm[1:0]# (breakpoint monitor) signals are breakpoint and performance monitor signals. they are outputs from the processor that indicate the status of breakpoints and programmable counters used for monitoring processor performance. bpri# (i - gtl+) the bpri# (bus priority request) signal is used to arbitrate for ownership of the system bus. it must be connected to the appropriate pins/balls on both agents on the system bus. observing bpri# active (as asserted by the priority agent) causes the processor t o stop issuing new requests, unless such requests are part of an ongoing locked operation. the priority agent keeps bpri# asserted until all of its requests are completed and then releases the bus by deasserting bpri#. breq0# (i/o - gtl+) the breq0# (bus r equest) signal is a processor arbitration bus signal. the processor indicates that it wants ownership of the system bus by asserting the breq0# signal. during power - up configuration, the central agent must assert the breq0# bus signal. the processor sampl es breq0# on the active - to - inactive transition of reset#. optionally, this signal may be grounded with a 10ohm resistor. bsel[1:0] (i ? 3.3 v tolerant) the bsel[1:0] (select processor system bus speed) signal is used to configure the processor for the s ystem bus frequency. table 36 shows the encoding scheme for bsel[1:0]. the only supported system bus frequency for the mobile pentium iii processor is 100 mhz. if another frequency is used or if the bsel[1:0] signa ls are not driven with ?01? then the processor is not guaranteed to function properly.
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz datas heet 245483 - 002 60 table 36 . bsel[1:0] encoding bsel[1:0] system bus frequency 00 66 mhz 01 100 mhz 10 reserved 11 133 mhz clkref (analog) the clkref (system b us clock reference) signal provides a reference voltage to define the trip point for the bclk signal. this signal should be connected to a resistor divider to generate 1.25v from the 2.5 - v supply. cmosref (analog) the cmosref (cmos reference voltage) sign al provides a dc level reference voltage for the cmos input buffers. a voltage divider should be used to divide a stable voltage plane (e.g., 2.5v or 3.3v). this signal must be provided with a dc voltage that meets the v cmosref specification from table 12 . d[63:0]# (i/o - gtl+) the d[63:0]# (data) signals are the data signals. these signals provide a 64 - bit data path between both system bus agents, and must be connected to the appropriate pins/balls on both agents. the data driver asserts drdy# to indicate a valid data transfer. dbsy# (i/o - gtl+) the dbsy# (data bus busy) signal is asserted by the agent responsible for driving data on the system bus to indicate that the data bus is in use. the data bus is released after dbsy# is deasserted. this signal must be connected to the appropriate pins/balls on both agents on the system bus. defer# (i - gtl+) the defer# (defer) signal is asserted by an agent to indicate that the transaction cannot be guaranteed in - order com pletion. assertion of defer# is normally the responsibility of the addressed memory agent or i/o agent. this signal must be connected to the appropriate pins/balls on both agents on the system bus. dep[7:0]# (i/o - gtl+) the dep[7:0]# (data bus ecc protect ion) signals provide optional ecc protection for the data bus. they are driven by the agent responsible for driving d[63:0]#, and must be connected to the appropriate pins/balls on both agents on the system bus if they are used. during power - on configurati on, dep[7:0]# signals can be enabled for ecc checking or disabled for no checking.
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz 245483 - 002 datasheet 61 drdy# (i/o - gtl+) the drdy# (data ready) signal is asserted by the data driver on each data transfer, indicating valid data on the data bus. in a multi - cycle data transfer, drdy# can be deasserted to insert idle clocks. this signal must be connected to the appropriate pins/balls on both agents on the system bus. edgctrlp (analog) the edgctrlp (edge rate control) signal is used to configure the edge rate of the gtl+ output bu ffers. connect the signal to v ss with a 110 - w , 1% resistor. ferr# (o - 1.5v tolerant open - drain) the ferr# (floating - point error) signal is asserted when the processor detects an unmasked floating - point error. ferr# is similar to the error# signal on the intel 387 coprocessor, and it is included fo r compatibility with systems using dos - type floating - point error reporting. flush# (i - 1.5v tolerant) when the flush# (flush) input signal is asserted, the processor writes back all internal cache lines in the modified state and invalidates all internal c ache lines. at the completion of a flush operation, the processor issues a flush acknowledge transaction. the processor stops caching any new data while the flush# signal remains asserted. on the active - to - inactive transition of reset#, each processor bus agent samples flush# to determine its power - on configuration. ghi# (i - 1.5v tolerant) the ghi# signal controls which operating mode bus ratio is selected in a mobile pentium iii processor featuring intel speedstep technology. on the processor featuring i ntel speedstep technology, this signal is latched when bclk restarts in deep sleep state and determines which of two bus ratios is selected for operation. this signal is ignored when the processor is not in the deep sleep state. this signal is a ?don?t car e? on processors that do not feature intel speedstep technology. this signal has an on - die pull - up to v cct and should be driven with an open - drain driver with no external pull - up. hit# (i/o - gtl+), hitm# (i/o - gtl+) the hit# (snoop hit) and hitm# (hit mo dified) signals convey transaction snoop operation results, and must be connected to the appropriate pins/balls on both agents on the system bus. either bus agent can assert both hit# and hitm# together to indicate that it requires a snoop stall, which can be continued by reasserting hit# and hitm# together. ierr# (o - 1.5v tolerant open - drain) the ierr# (internal error) signal is asserted by the processor as the result of an internal error. assertion of ierr# is usually accompanied by a shutdown transactio n on the system bus.
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz datas heet 245483 - 002 62 this transaction may optionally be converted to an external error signal (e.g., nmi) by system logic. the processor will keep ierr# asserted until it is handled in software or with the assertion of reset#, binit, or init#. ignne# (i - 1.5v tolerant) the ignne# (ignore numeric error) signal is asserted to force the processor to ignore a numeric error and continue to execute non - control floating - point instructions. if ignne# is deasserted, the processor freezes on a non - control floating - p oint instruction if a previous instruction caused an error. ignne# has no affect when the ne bit in control register 0 (cr0) is set. init# (i - 1.5v tolerant) the init# (initialization) signal is asserted to reset integer registers inside the processor wit hout affecting the internal (l1 or l2) caches or the floating - point registers. the processor begins execution at the power - on reset vector configured during power - on configuration. the processor continues to handle snoop requests during init# assertion. in it# is an asynchronous input. if init# is sampled active on reset#'s active - to - inactive transition, then the processor executes its built - in self test (bist). intr (i - 1.5v tolerant) the intr (interrupt) signal indicates that an external interrupt has bee n generated. intr becomes the lint0 signal when the apic is enabled. the interrupt is maskable using the if bit in the eflags register. if the if bit is set, the processor vectors to the interrupt handler after completing the current instruction execution. upon recognizing the interrupt request, the processor issues a single interrupt acknowledge (inta) bus transaction. intr must remain active until the inta bus transaction to guarantee its recognition. lint[1:0] (i - 1.5v tolerant) the lint[1:0] (local api c interrupt) signals must be connected to the appropriate pins/balls of all apic bus agents, including the processor and the system logic or i/o apic component. when apic is disabled, the lint0 signal becomes intr, a maskable interrupt request signal, and lint1 becomes nmi, a non - maskable interrupt. intr and nmi are backward compatible with the same signals for the pentium processor. both signals are asynchronous inputs. both of these signals must be software configured by programming the apic register spa ce to be used either as nmi/intr or lint[1:0] in the bios. if the apic is enabled at reset, then lint[1:0] is the default configuration. lock# (i/o - gtl+) the lock# (lock) signal indicates to the system that a sequence of transactions must occur atomicall y. this signal must be connected to the appropriate pins/balls on both agents on the system bus. for a locked sequence of transactions, lock# is asserted from the beginning of the first transaction through the end of the last transaction.
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz 245483 - 002 datasheet 63 when the priorit y agent asserts bpri# to arbitrate for bus ownership, it waits until it observes lock# deasserted. this enables the processor to retain bus ownership throughout the bus locked operation and guarantee the atomicity of lock. nmi (i - 1.5v tolerant) the nmi (non - maskable interrupt) indicates that an external interrupt has been generated. nmi becomes the lint1 signal when the apic is disabled. asserting nmi causes an interrupt with an internally supplied vector value of 2. an external interrupt - acknowledge tra nsaction is not generated. if nmi is asserted during the execution of an nmi service routine, it remains pending and is recognized after the iret is executed by the nmi service routine. at most, one assertion of nmi is held pending. nmi is rising edge sens itive. picclk (i - 2.5v tolerant) the picclk (apic clock) signal is an input clock to the processor and system logic or i/o apic that is required for operation of the processor, system logic, and i/o apic components on the apic bus. picd[1:0] (i/o - 1.5v tolerant open - drain) the picd[1:0] (apic data) signals are used for bi - directional serial message passing on the apic bus. they must be connected to the appropriate pins/balls of all apic bus agents, including the processor and the system logic or i/o api c components. if the picd0 signal is sampled low on the active - to - inactive transition of the reset# signal, then the apic is hardware disabled. pll1, pll2 (analog) the pll1 and pll2 signals provide isolated analog decoupling is required for the internal pl l. see section 3.2.2 for a description of the analog decoupling circuit. prdy# (o - gtl+) the prdy# (probe ready) signal is a processor output used by debug tools to determine processor debug readiness. preq# ( i - 1.5v tolerant) the preq# (probe request) signal is used by debug tools to request debug operation of the processor. pwrgood (i - 2.5v tolerant) pwrgood (power good) is a 2.5 - v tolerant input. the processor requires this signal to be a clean indication that clocks and the power supplies (v cc , v cct , etc.) are stable and within their specifications. clean implies that the signal will remain low, (capable of sinking leakage current) and without glitches, from the time that the power supplies are turned on, until they come within specification. the signal will then transition monotonically to a high (2.5v) state. figure 26 illustrates the relationship of pwrgood to other system signals. pwrgood can be driven
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz datas heet 245483 - 002 64 inactive at any time, but clocks and power must again be stable before the rising edge of pwrgood. it must also meet the minimum pulse width specified in table 16 (section 3.7 ) and be followed by a 1 ms reset# pulse. figure 26 . pwrgood relationship at power on bclk pwrgood reset# d0026-01 1 msec v ih25 ,min v cc , v cct , v ref the pwrgood signal, which must be supplied to the processor, is used to protect internal circuits against voltage sequenci ng issues. the pwrgood signal should be driven high throughout boundary scan operation. req[4:0]# (i/o - gtl+) the req[4:0]# (request command) signals must be connected to the appropriate pins/balls on both agents on the system bus. they are asserted by th e current bus owner when it drives a[35:3]# to define the currently active transaction type. reset# (i - gtl+) asserting the reset# signal resets the processor to a known state and invalidates the l1 and l2 caches without writing back modified (m state) l ines. for a power - on type reset, reset# must stay active for at least 1 msec after v cc and bclk have reached their proper dc and ac specifications and after pwrgood has been asserted. when observing active reset#, all bus agents will deassert their outputs within two clocks. reset# is the only gtl+ signal that does not have on - die gtl+ termination. a 56.2 w 1% terminating resistor connected to v cct is required. a number of bus signals are sampled at the active - to - inactive transition of reset# for the power - on configuration. the configuration options are described in section 4 and in the pentium ? ii processor developer?s manual . unless its outputs are tri - stated during power - on configuration, after an active - to - inactive transition of reset#, the processor optionally executes its built - in self - test (bist) and begins pro gram execution at reset - vector 000ffff0h or fffffff0h. reset# must be connected to the appropriate pins/balls on both agents on the system bus.
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz 245483 - 002 datasheet 65 rp# (i/o - gtl+) the rp# (request parity) signal is driven by the request initiator and provides parity protecti on on ads# and req[4:0]#. rp# should be connected to the appropriate pins/balls on both agents on the system bus. a correct parity signal is high if an even number of covered signals are low and low if an odd number of covered signals are low. this definit ion allows parity to be high when all covered signals are high. rs[2:0]# (i - gtl+) the rs[2:0]# (response status) signals are driven by the response agent (the agent responsible for completion of the current transaction) and must be connected to the appro priate pins/balls on both agents on the system bus. rsp# (i - gtl+) the rsp# (response parity) signal is driven by the response agent (the agent responsible for completion of the current transaction) during assertion of rs[2:0]#. rsp# provides parity prot ection for rs[2:0]#. rsp# should be connected to the appropriate pins/balls on both agents on the system bus. a correct parity signal is high if an even number of covered signals are low, and it is low if an odd number of covered signals are low. during id le state of rs[2:0]# (rs[2:0]#=000), rsp# is also high since it is not driven by any agent guaranteeing correct parity. rsvd (tbd) the rsvd (reserved) signal is currently unimplemented but is reserved for future use. leave this signal unconnected. intel re commends that a routing channel for this signal be allocated. rttimpedp (analog) the rttimpedp (r tt impedance/pmos) signal is used to configure the on - die gtl+ termination. connect the rttimpedp signal to v ss with a 56.2 - w , 1% resistor. slp# (i - 1.5v tolerant) the slp# (sleep) signal, when asserted in the stop grant state, causes the processor to enter the sleep state. during the sleep state, the processor stops providing internal clock signals to all units, leaving only the phase - locked loop (pll) still running. the processor will not recognize snoop and interrupts in the sleep state. the processor will only recognize changes in the slp#, stpclk# and reset# signals while in the sleep state. if slp# is deasserted, the proc essor exits sleep state and returns to the stop grant state in which it restarts its internal clock to the bus and apic processor units.
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz datas heet 245483 - 002 66 smi# (i - 1.5v tolerant) the smi# (system management interrupt) is asserted asynchronously by system logic. on accepti ng a system management interrupt, the processor saves the current state and enters system management mode (smm). an smi acknowledge transaction is issued, and the processor begins program execution from the smm handler. stpclk# (i - 1.5v tolerant) the stpc lk# (stop clock) signal, when asserted, causes the processor to enter a low - power stop grant state. the processor issues a stop grant acknowledge special transaction and stops providing internal clock signals to all units except the bus and apic units. the processor continues to snoop bus transactions and service interrupts while in the stop grant state. when stpclk# is deasserted, the processor restarts its internal clock to all units and resumes execution. the assertion of stpclk# has no affect on the bus clock. tck (i - 1.5v tolerant) the tck (test clock) signal provides the clock input for the test bus (also known as the test access port). tdi (i - 1.5v tolerant) the tdi (test data in) signal transfers serial test data to the processor. tdi provides the serial input needed for jtag support. tdo (o - 1.5v tolerant open - drain) the tdo (test data out) signal transfers serial test data from the processor. tdo provides the serial output needed for jtag support. testhi (i - 1.5v tolerant) the testhi (test inpu t high) is used during processor test and needs to be pulled high during normal operation. testlo[2:1] (i - 1.5v tolerant) the testlo[2:1] (test input low) signals are used during processor test and needs to be pulled to ground during normal operation. t estp (analog) the testp (test point) signals are connected to v cc and v ss at opposite ends of the die. these signals can be used to monitor the vcc level on the die. route the testp signals to test points or leave them unconnected. do not short the testp s ignals together.
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz 245483 - 002 datasheet 67 thermda, thermdc (analog) the thermda (thermal diode anode) and thermdc (thermal diode cathode) signals connect to the anode and cathode of the on - die thermal diode. tms (i - 1.5v tolerant) the tms (test mode select) signal is a jtag suppo rt signal used by debug tools. trdy# (i - gtl+) the trdy# (target ready) signal is asserted by the target to indicate that the target is ready to receive write or implicit write - back data transfer. trdy# must be connected to the appropriate pins/balls on b oth agents on the system bus. trst# (i - 1.5v tolerant) the trst# (test reset) signal resets the test access port (tap) logic. the mobile pentium iii processors do not self - reset during power on; therefore, it is necessary to drive this signal low during p ower - on reset. vid[4:0] (o ? open - drain) the vid[4:0] (voltage id) pins/balls can be used to support automatic selection of power supply voltages. these pins/balls are not signals, they are either an open circuit or a short to v ss on the processor substrat e. the combination of opens and shorts encodes the voltage required by the processor. external to pull - ups are required to sense the encoded vid. for processors that have intel speedstep technology enabled, vid[4:0] encode the voltage required in the batte ry - optimized mode. vid[4:0] are needed to cleanly support voltage specification changes on mobile pentium iii processors. the voltage encoded by vid[4:0] is defined in table 37 . a ?1? in this table refers to an ope n pin/ball and a ?0? refers to a short to v ss . the power supply must provide the requested voltage or disable itself. please note that in order to implement vid on the bga2 package, some vid[4:0] balls may be depopulated. for the bga2 package, a ?1? in table 37 implies that the corresponding vid ball is depopulated, while a ?0? implies that the corresponding vid ball is not depopulated. but on the micro - pga2 package, vid[4:0] pins are not depopulated.
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz datas heet 245483 - 002 68 table 37 . voltage identification encoding vid[4:0] v cc vid[4:0] v cc vid[4:0] v cc vid[4:0] v cc 00000 2.00 01000 1.60 10000 1.275 11000 1.075 00001 1.95 01001 1.55 10001 1.250 11001 1.050 00010 1.90 01010 1.50 10010 1.225 11010 1.025 00011 1.8 5 01011 1.45 10011 1.200 11011 1.000 00100 1.80 01100 1.40 10100 1.175 11100 0.975 00101 1.75 01101 1.35 10101 1.150 11101 0.950 00110 1.70 01110 1.30 10110 1.125 11110 0.925 00111 1.65 01111 no cpu 10111 1.100 11111 no cpu vref (analog) the vref (gtl + reference voltage) signal provides a dc level reference voltage for the gtl+ input buffers. a voltage divider should be used to divide v cct by 2 / 3 . intel recommends resistor values of 1.00 k w and 2.00 k w . decouple the vref signal with three 0.1 - m f high frequency capacitors close to the processor.
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz 245483 - 002 datasheet 69 8.2 signal summaries table 38 through table 41 list the attributes o f the processor input, output, and i/o signals. table 38 . input signals name active level clock signal group qualified a20m# low asynch cmos always bclk high ? system bus always bpri# low bclk system bus always bsel[1:0] high a synch implementation always defer# low bclk system bus always flush# low asynch cmos always ghi# low asynch cmos deep sleep state ignne# low asynch cmos always init# low asynch system bus always intr high asynch cmos apic disabled mode lint[1:0] hig h asynch apic apic enabled mode nmi high asynch cmos apic disabled mode picclk high ? apic always preq# low asynch implementation always pwrgood high asynch implementation always reset# low bclk system bus always rs[2:0]# low bclk system bus always rsp# low bclk system bus always slp# low asynch implementation stop grant state smi# low asynch cmos always stpclk# low asynch implementation always tck high ? jtag tdi tck jtag tms tck jtag trdy# low bclk system bus response phase trst# low a synch jtag
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz datas heet 245483 - 002 70 table 39 . output signals name active level clock signal group ferr# low asynch open - drain ierr# low asynch open - drain prdy# low bclk implementation tdo high tck jtag vid[4:0] high asynch implementation table 40 . input/output signals (single driver) name active level clock signal group qualified a[35:3]# low bclk system bus ads#, ads#+1 ads# low bclk system bus always ap[1:0]# low bclk system bus ads#, ads#+1 breq0# low bclk system bus always bp[3:2]# low bclk system bus always bpm[1:0]# low bclk system bus always d[63:0]# low bclk system bus drdy# dbsy# low bclk system bus always dep[7:0]# low bclk system bus drdy# drdy# low bclk system bus always lock# low bclk system bus always req[4:0]# low bclk system bus ads#, ads#+1 rp# low bclk system bus ads#, ads#+1 table 41 . input/output signals (multiple driver) name active level clock signal group qualified aerr# low bclk system bus ads#+3 berr# low bclk sy stem bus always binit# low bclk system bus always bnr# low bclk system bus always hit# low bclk system bus always hitm# low bclk system bus always picd[1:0] high picclk apic always
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz 245483 - 002 datasheet 71 appendix a. pll rlc filter specification a.1 introduction all mobile pentium ii and mobile pentium iii processors have internal pll clock generators, which are analog in nature and require quiet power supplies for minimum jitter. jitter is detrimental to a system; it degrades external i/o timings as well as internal core timings (i.e . maximum frequency). in mobile pentium ii processors, the power supply filter was specified as an external lc network. this remains largely the same for the mobile pentium iii processor. however, due to increased current flow, the value of the inductor has to be reduced, thereby requiring new components. the general desired topology is shown in figure 5 . excluded from the external circuitry are parasitics associated with each component. a.2 filter specificatio n the function of the filter is two fold. it protects the pll from external noise through low - pass attenuation. it also protects the pll from internal noise through high - pass filtering. in general, the low - pass description forms an adequate description for the filter. the ac low - pass specification, with input at v cct and output measured across the capacitor, is as follows: < 0.2 db gain in pass band < 0.5 db attenuation in pass band < 1 hz (see dc drop in next set of requirements) 34 db attenuation from 1 mhz to 66 mhz 28 db attenuation from 66 mhz to core frequency the filter specification (ac) is graphically shown in figure 27 . other requirements: use a shielded type inductor to minimize magnetic pickup the filt er should support a dc current of at least 30 ma the dc voltage drop from v cct to pll1 should be less than 60 mv, which in practice implies series resistance of less than 2 w . this also means that the pass band (from dc to 1hz) attenuation below 0.5 db is for v cct = 1.1v and below 0.35 db for v cct = 1.5v.
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz datas heet 245483 - 002 72 figure 27 . pll filter specifications 0 db - 28 db - 34 db 0.2 db forbidden zone x db forbidden zone 1 mhz 66 mhz fcore fpeak 1 hz dc passband high frequency band x = 20.log[(vcct - 60 mv)/ vcct ] notes: diagram is not to scale n o specification for frequencies beyond f core . f peak , if existent, should be less than 0.05 mhz. a.3 recommendation for mobile systems the following lc components are recommended. the tables will be updated as other suitable components and specifications are identified. table 42 . pll filter inductor recommendations inductor part number value tol srf rated i dcr min damping r needed l1 tdk mlf2012a4r7kt 4.7 m h 10% 35 mhz 30 ma 0.56 w (1 w max) 0 w l2 murata lqg21n4r7k10 4.7 m h 10% 47 mhz 30 ma 0.7 w (+/ - 50%) 0 w l3 murata lqg21c4r7n00 4.7 m h 30% 35 mhz 30 ma 0.3 w max 0.2 w (assumed) note: minimum damping resistance is calculated from 0.35 w ? dcr min . from vendor provi ded data, l1 and l2 dcr min is 0.4 w and 0.5 w respectively, qualifying them for zero required trace resistance. dcr min for l3 is not known and is assumed to be 0.15 w . there may be other vendors who might provide parts of equivalent characteristics and the o ems should consider doing their own testing for selecting their own vendors.
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz 245483 - 002 datasheet 73 table 43 . pll filter capacitor recommendations capacitor part number value tolerance esl esr c1 kemet t495d336m016as 33 m f 20% 2.5 nh 0.225 w c2 avx tpsd3 36m020s0200 33 m f 20% unknown 0.2 w note: there may be other vendors who might provide parts of equivalent characteristics and the oems should consider doing their own testing for selecting their own vendors. table 44 . pll filter resistor recommendations resistor part number value tolerance power r1 various 1 w 10% 1/16w to satisfy damping requirements, total series resistance in the filter (from v cct to the top plate of the capacitor) must be at least 0.35 w . this resistor can be in the form of a discrete component, or routing, or both. for example, if the picked inductor has minimum dcr of 0.25 w , then a routing resistance of at least 0.10 w is required. be careful not to exceed the maximum resistance rule (2 w ). for example, if using di screte r1, the maximum dcr of the l should be less than 2.0 - 1.1 = 0.9 w , which precludes using l2 and possibly l1. other routing requirements: the capacitor should be close to the pll1 and pll2 pins, with less than 0.1 w per route (these routes do not coun t towards the minimum damping resistance requirement). the pll2 route should be parallel and next to the pll1 route (minimize loop area). the inductor should be close to the capacitor; any routing resistance should be inserted between vcct and the inductor . any discrete resistor should be inserted between vcct and the inductor. a.4 comments a magnetically shielded inductor protects the circuit from picking up external flux noise. this should provide better timing margins than with an unshielded inductor. a discrete or routed resistor is required because the lc filter by nature has an under - damped response, which can cause resonance at the lc pole. noise amplification at this band, although not in the pll - sensitive spectrum, could cause a fatal headroom reduction for analog circuitry. the resistor serves to dampen the response. systems with tight space constraints should consider a discrete resistor to provide the required damping resistance. too large of a damping resistance can cause a large ir drop, w hich means less analog headroom and lower frequency. ceramic capacitors have very high self - resonance frequencies, but they are not available in large capacitance values. a high self - resonant frequency coupled with low esl/esr is crucial for sufficient re jection in the pll and high frequency band. the recommended tantalum capacitors have acceptably low esr and esl. the capacitor must be close to the pll1 and pll2 pins, otherwise the value of the low esr tantalum capacitor is wasted. note the distance con straint should be translated from the 0.1 - w requirement. the mobile pentium ii processor lc filter cannot be used with the mobile pentium iii processor. the larger inductor of the old lc filter imposes a lower current rating. due to increased current requi rements for the mobile pentium iii processor, a lower value inductor is required.
mobile pentium? iii processor in bga2 and micro - pga2 packages at 750 mhz, 700 mhz, and low - voltage 600 mhz datas heet 245483 - 002 74 appendix b. intel mobile voltage positioning (imvp) for the mobile pentium iii processor b.1 introduction intel mobile voltage positioning (imvp) is an advanced voltage regulation techn ology for intel's high performance mobile processors. thermal design is critical to compete in the mobile high performance segments and imvp technology will provide designers with a competitive edge. utilizing imvp technology for microprocessor voltage r egulator designs will significantly reduce cpu power, which will provide thermal benefits needed for thin and light performance systems. imvp technology offers the following two design options: design for cost optimization design for maximum core power r eduction b.2 reference d ocuments intel? mobile voltage positioning voltage regulation controller application note, rev 1.x (or - 2101)

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